M. Rencz, V. Székely, A. Poppe: Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems, accepted to DTIP

M. Rencz, A. Poppe, V. Székely, B. Courtois: Inclusion of RC compact models of packages into board level thermal simulation tools, SEMITHERM, March 1-14 2002,San Jose, CA, USA

M. Rencz, V. Székely, A. Morelli, C. Villa: Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities, SEMITHERM, March 1-14 2002, San Jose, CA,USA

M. Rencz: New possibilities in the thermal evaluation offered by transient testing, invited talk at THERMES 2002, January 13-16, 2002,Santa Fe, New Mexico, USA,
printed in the book of "Thermal Chellenges in Next Gneration Electronic Systems", ed. Joshi & Garimella, Millpress 2002 Rotterdam, ISBN 90 77017038, pp 65-74

V. Székely, M. Rencz, A. Poppe, G. Farkas: User friendly tools for the thermal simulation and modeling of electronic subsystems ,Accepted to EurosimE 2002, 15-16 April 2002, Paris, France, Proceedings pp

M. Rencz, V. Székely, B. Courtois: An algorithm for the inclusion of RC compact models of packages into board level thermal simulation tools, Intl. Conference on Modeling and Simulation of Microsystems, MSM 2002, April 22-25, 2002, San Juan, Puerto Rico, Proceedings pp

M. Rencz, V. Szekely, A. Poppe, G. Farkas, B. Courtois: New methods and supporting tools for the thermal transient testing of packages, APACK 2001, Singapore, 5-7 Dec. 2001, Proceedings pp 407-141

A. Poppe, M. Rencz, V. Székely, G. Mezei: Development of a platform independent electro-thermal simulator, THERMINIC Workshop, Sept.24-27, Paris, France, 2001, Proceedings pp 275-280

V.Székely, M.Rencz, L.Pohl : Novelties in the theory and practice of thermal transient measurements, THERMINIC Workshop,, Sept.24-27, Paris, France, 2001,Proceedings pp 239-244

M.Rencz, V.Székely: Determining partial thermal resistances in a heat flow path with the help of transient measurements, THERMINIC Workshop, Sept.24-27, Paris, France, 2001,Proceedings pp 250-255

M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois: New tools and methods for the thermal transient testing of packages. HD International 2001. Santa Clara, CA, USA, April 18-20. 2001, Proceedings pp 268-273

A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely, K. Torki, S. Mir, B. Courtois: Design issues of a multi functional intelligent thermal test die. Proceedings of the SEMI-THERM XVII, San Jose, CA, USA, March 20-22, 2001, pp

M. Rencz, V. Székely: A generic method for thermal multiport model generation of IC packages. SEMI-THERM XVII, San Jose, CA, USA, March 20-22, 2001, Proc. pp 145-152

V. Székely, É. Nikodémusz, L. Pohl, M. Rencz: New developments in thermal transient testing. MIXDES 2001, Zakopane, Poland, 21-23 June, 2001

M. Rencz, V. Székely, B. Courtois: A method for generating dynamic thermal multiport models of packages. InterPACK'01, Kaual, Hawaii, USA, July 8-13, 2001

M. Rencz, V. Székely, B. Courtois: Uncovering die attach problems with the help of thermal transient measurements. SEMICON WEST 2001, San Jose, CA, USA, July 18-20, 2001, Proceedings pp 63-76, SEMI

Zs. Benedek, G. Farkas, I. Pohl, A. Poppe, M. Rencz, V. Székely, K. Torki, S. Mir: Design of a multi-functional intelligent thermal test die. Submitted to DATE 2001

M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal evaluation and modelling of MEMS packages. Proc. of the 4^th 2000 IEMT/IMC Symposium, April 19-21, 2000, Tokyo, Japan, pp. 326-331

M. Rencz, V. Székely, Zs. Kohári, B. Courtois: A method for thermal model generation of MEMS packages. Proc. of the MSM 2000, pp. 209-212

V. Székely, A. Poppe, M. Rencz: Algorithmic extension of thermal field solvers: the time constant analysis. Proc. of the SEMI-THERM Symposium, March 21-23, 2000, Double Tree Hotel, San Jose, CA, USA, pp. 99-106

M. Rencz, V. Székely, Zs. Kohári, B. Courtois: Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages. Proc. of the Itherm 2000, May 23-26, Las Vegas, Nevada, USA, pp. 120-126

V. Székely, A. Poppe, M. Rencz: User friendly thermal simulators for research and education. ISSE 2000, Balatonfüred, May 6-10. 2000, Hungary. Proceedings, pp. 106-111

V. Székely, M. Rencz, A. Poppe, B. Courtois: THERMODEL: A tool for thermal model generation, and application for MEMS packages, SPIE DTIP Conference, May. 9-11. Paris, France. Proceedings, pp. 39-49, 2000

S. Mir, B. Charlor, G. Nicolescu, P. Coste, F. Parrain, N. Zergainoh, B. Courtois, A. Jeraya, M. Rencz: Towards design and validation of mixed-technology SOCs. The 10^th Great Lakes Symposium on VLSI, Chicago, Illinois, USA, pp.9-20

M. Rencz, V. Székely, a. Poppe, B. Courtois: Friendly tools for the thermal simulation of power packages. IWIPP, July 14-15, 2000. Waltham, MA, USA, proceedings pp. 51-54

A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely, K. Torki, S. Mir, B. Courtois: Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and measurement data acquisition. The 6^th Therminic Workshop, September 24-27, Budapest, Hungary, Proceedings, pp. 267-272

V. Székely, G. Farkas, É. Nokodémusz, M. Rencz, S. Ress, S. Török: New procedures for thermal transient testing. The 6^th Therminic Workshop, September 24-27, Budapest, Hungary, Proceedings, pp. 15-19

V. Székely, M. Rencz, S. Török, S. Ress, B. Vizy: Experiments on effective board thermal conductivity measurements. The 6^th Therminic Workshop, September 24-27, Budapest, Hungary, Proceedings, pp. 26-30

M. Rencz, V. Székely, E. Kollár: Measuring dynamic thermal multiport parameters of IC packages. The 6th Therminic Workshop, September 24-27, Budapest, Hungary, Proceedings, pp 244-251

S. Ress, E. Kollár: Comparison of various thermal transient measurement methods on a benchmark package. The 6^th Therminic Workshop, September 24-27, Budapest, Hungary, Proceedings, pp. 120-122

V. Székely, M. Rencz, B. Courtois: New tools for the thermal transient testing of packages and MCMs. 7^th Annual KGD Packaging & Test Workshop, September 10-13, 2000. Napa, CA, USA. Proceedings pp. 269-284

M. Rencz, V. Székely, A. Poppe, B. Courtois: From MEMs to the global simulation of SocS. International Symposium on Microelectronics and Assembly (ISMA) 2000, Nov. 27-Dec. 1. 2000 pp. 9-22

V. Székely, M. Rencz, A. Poppe, B. Courtois: New hardware tools for the thermal transient testing of packages. The 3^rd Electronics Packaging Technology Conference, (EPTC) 2000, 5-7 December, 2000, Singapore pp. 46-52

E.B. Várhegyi, G. Kiss, J. Mizsei*, O.H. Krafcsik, G. Négyesi, B. Ostrick**, H.Meixner** and F. Réti, Examination of the Co/Pt/Cu Layer Structure with Kelvin Probe and XPS Analysis, European Conference on Solid-State Transducers, September 12-15, 1999, The Hague, The Netherlands, poster, 25P14 Proc. Of the Eurosensors XIII, p855.

G. Hosszú, F. Kovács, L. Varga: "Design Procedure Based on VHDL Language Transformations", IEEE International Symposium on Circuits and Systems, Orlando, Florida, USA May 30-June 2, 1999

L. Varga, G. Hosszú, F. Kovács: "VHDL Based High-Level Synthesis for Datapath-Intensive Architectures", International Workshop on Design, Test and Applications, Dubrovnik, Croatia, June 14-16, 1999

L. Varga, G. Hosszú, F. Kovács: "Circuit Synthesis Based on VHDL Language Transformations", IEEE International Conference on Electronics, Circuit and Systems, Paphos, Cyprus, September 5-8, 1999

V. Székely, A. Páhi, M. Rosenthal, M. Rencz: SUNRED: a field solver and compact model generator tool based on successive mode reduction. MSM'99, April 19-21, 1999, San Juan, Puerto Rico, USA, pp. 342-345

V. Székely, M. Rencz, B. Courtois: Simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PCBs. Proceedings of the 1999 Southwest Symposium on Mixed-Signal Design, April 11-13, 1999, Tucson, Arizona, USA, pp. 168-173

M. Rencz, V. Székely, A. Páhi, A. Poppe: An alternative method for electro-thermal circuit simulation., Proceedings of the 1999 Southwest Symposium on Mixed-Signal Design, April 11-13, 1999, Tucson, Arizona, USA, pp. 117-122

V. Székely, A. Páhi, M. Rencz: SUNRED, a new field solving approach. Symposium on Design, Test and Microfabrication of MEMS/MOEMS, 30 March - 1 April, 1999, Paris, France, pp. 278-288

J. Mizsei, M. Rencz: Microsystems - research at the Department of Electron Devices, MEMS Conference, Budapest, May 1999

V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN: a thermal-simulation tool for IC chips, microstructures and PW boards. Proceedings of MIXDES'99, 6th International Conference, Krakow, Poland, 17-19 June, 1999, pp. 331-336

V. Székely: Restoration of physical structures: an approach based on the theory of RC networks. Proceedings of the ECCTD'99, European Conference on Circuit Theory and Design, 29 August - 2. September 1999, Stresa, Italy, pp. 1131-1134

V. Székely, M. Rencz, B. Courtois: Thermal Transient Evaluation of Packaging with the TTMK Toolkit. Proceedings of the InterPACK'99 Conference, Maui, Hawaii, USA, June 13-17, 1999, pp. 2199-2206

B. Courtois, J.M. Karam, S. Mir, M. Lubaszewski, V. Székely, M. Rencz, K. Hofmann, M. Glesner: Design and Test of MEMS. Proceedings of the VLSI Design'99, Jan. 7-10, 1999, Goa, India

M. Rencz, V. Székely, A. Páhi, A. Poppe: Algorithmic and practical questions of electro-thermal circuit simulation. Proceedings of the International Symposium on Microelectronics and Micro-Electromechanical Systems, 27-29 October, 1999, Royal Pines Resort, Queensland, Australia, Vol. 3893, pp. 178-187

V. Székely, M. Rencz, B. Courtois: Tool and Method for the Thermal Transient Evaluation of Packages, Proceedings of the International Symposium on Microelectronics and Micro-Electromechanical Systems, 27-29 October, 1999, Royal Pines Resort, Queensland, Australia, Vol. 3893, pp. 94-103

Székely V.: Gondolatok az oktatástechnikáról. Műegyetem 2000, Budapest, 1999. január 20-21, Konferenciakiadvány, p. 76 (In Hungarian)

Kerecsenné Rencz Márta, Székely V.: Tapasztalatok az Európai kutatási projektekben való részvétellel kapcsolatban. Műegyetem 2000, Budapest, 1999. január 20-21, Konferenciakiadvány, p. 181 (In Hungarian)

V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek, B. Courtois, M. Rencz: Transient thermal measurements for dynamic package modeling: new approaches. Proceedings of the Therminic Workshop'99, October, Rome, Italy, pp. 7-11

V. Székely, A. Nagy, S. Török, G. Hajas, M. Rencz: Heat sinks with controlled thermal resistance: an experiment. Proceedings of the Therminic Workshop'99, October, Rome, Italy, pp. 249-251

V. Székely, A. Páhi, A. Poppe, M. Rosental, T. Teszéri, M. Rencz: Thermal time constant analysis and implementation in the THERMAN and SUNRED thermal simulation tools. Proceedings of the Therminic Workshop'99, October, Rome, Italy, pp. 343-348

M. Oláh, S. Török, A. Poppe, P. Masa, A. Lőrincz: Design and Evaluation of a Grassfire Skeletonization Chip. MIXDES'99, Krakow, Poland, 17-19 June, 1999, pp. 477-481

M. Oláh, S. Török, A. Poppe, P. Masa, A. Lőrincz: Mixed-Signal VLSI for Skeletonization by Grassfire Transformation - Design and Evaluation. ECS'99, Bratislava, Slovakia, Aug. 1999

M. Rencz, V. Székely, Zs. Kohári, S. Ress, A. Páhi, A. Poppe: Thermal evaluation of the SIP9 package. Proceedings of the Therminic Workshop'99, October, Rome, Italy, pp. 111-116

A. Poppe, Gy. Csaba, K. Tarnay, V. Székely: Considering electro-thermal interactions in sub-micron n-MOS transistors on microscopic scale within a 3D particle dynamics based Monte Carlio simulator. Proc. of the 5th Therminic Workshop, 3-6 October 1999, Rome, Italy, pp. 134-137.

V. Székely, M. Rencz, A. Poppe, B. Courtois: New Way for Thermal Transient Testing. SEMI-THERM – The Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Diego, 9-11 March 1999, CA, USA. Proceedings 1999, pp. 182-188

Oláh Miklós, dr. Poppe András, dr. Lőrincz András: Szenzoros információ feldolgozása analóg VLSI rendszerekkel (A MATÁV-PKI Tudományos Napok keretén belül, 1999. november 24-én ugyanezen címmel elhangzott előadás kézirata)

J. Mizsei , Surface and Interface Potentials in Semiconductor Chemical Sensors, SGS 98, I International Seminar on Semiconductor Gas sensors, 22-25. Sept. 1998., Ustron, Poland, invited lecture.

Mizsei, M. Karppinen, L. Pirttiaho, V. Lantto, Nanoparticle: Catalysts by Agglomeration of Nanofilms, Proceedings of the XXXII Annual Conference of the Finnish Physical Society, March 19-21, 1998, Tampere, Finland.

J. Mizsei, P. Sipilä and V. Lantto: Structural studies of sputtered noble metal catalysts on oxide surfaces, Proceedings of EUROSENSORS XI, The 11th European Conference on Solid State Transducers, Warsaw, Poland, September 21-24, 1997, 203-206.

J.Mizsei: Olfactory images by scanning Kelvin method, Proceedings of EUROSENSORS XI, The11th European Conference on Solid State Transducers, Warsaw, Poland, September 21-24, 1997, 167-170.
Sensors and Actuators B 48 (1998) 300-304.

J. Mizsei: Thermal effects in chemical sensing, 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology, 6-8 May 1998., Budapest, Hungary, invited lecture, informal proc.

J.Mizsei, L. Pirttiaho, M. Karppinen and V. Lantto: Nanocatalyst Sensitisers by Agglomeration of Nanofilms, Technical Digest of the 7th. International Meeting on Chemical Sensors, July 27-30, 1998, Beijing, China, pp541-543.

Bársony, M. Ádám, S. D. Kolev, Cs. Dücsô, J. Mizsei, É. Vázsonyi, I. Szabó and A. van den Berg: Fast, efficient bulk micro-machined heater for integrated sensor applications, EUROSENSORS XII, Southampton, September 13-16, 1998, Proceedings of the 12th European Conference on Solid-State Transducers and the 9th UK Conference on Sensors and their Applications, Vol. 2., pp. 905-908 (1998)

V. Székely, M. Rencz, A. Páhi, A. Poppe, Sz. Hajder: Thermal simulation tools for microsystem elements. MSM'98, Proc. pp. 463-468, April 6-8, 1998, Santa Clara, California, USA

J.M. Karam, B. Courtois, H. Boutamine, A. Cao, J. Rodriguez, V. Székely, M. Rencz, K. Hoffmann, M. Glesner: A Composite Integrated Mixed-Technology Design Environment to Support Micro Electro Mechanical Systems Development. MSM'98, Proc. T418, April 6-8, 1998, Santa Clara, California, USA

V. Székely, M. Rencz: Fast Field Solvers for Thermal and Electrostatic Analysis, DATE’98 Proceedings, Feb. 23-26, pp. 518-523, 1998

V. Székely, M. Rencz, B. Courtois: Application results of a new thermal benchmark chip, SEMI-THERM Symposium, 1998, March, San Diego, USA, Proceeding, pp. 1998

V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing Without a Tester, SEMICON West'98, July 13-17, San Jose, USA, Proceedings, pp. D1-10/Section II.

V. Székely, M. Rencz, Cs. Márta, B. Courtois: Various Aspects of the Design for Thermal Testability (DfTT), ETW'98, IEEE European Test Workshop, Sitges, Barcelona, Spain, May 27-29, 1998, Proceedings, pp. 55-61.

A. Páhi, V. Székely: Efficient thermal simulators: SUNRED and Quick THERM, IEEE International Workshop on Design, Test and Applications, Dubrovnik, Croatia, June 8-10, 1998, pp. 85-88, ISBN 953-184-009-1

G. Hajas, A. Páhi, Sz. Hajder, A. Poppe, M. Rencz, V. Székely: Logi-thermal simulation: a new approach for considering thermal effects in digital deisigns, IEEE International Workshop on Design, Test and Applications, Dubrovnik, Croatia, June 8-10, 1998, pp. 89-92, ISBN 953-184-009-1

A. Páhi, V. Székely, M. Rencz, A. Poppe, Sz. Hajder: New Software tools for the thermal and electrostatic simulation of microsystem elements, 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology, 6-8 May, 1998, Budapest, Hungary, Proceedings, pp. 162-169

G. Hajas, A. Páhi, Sz. Hajder, A. Poppe, M. Rencz, V. Székely: Thermal Investigation of Digital Integrated Circuits, 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology, 6-8 May, 1998, Budapest, Hungary, Proceedings, pp. 49-54

B. Courtois, J.M. Karam, S. Mir, M. Lubaszewski, V. Székely, M. Rencz, G. Kelly, J. Alderman, A. Morrissey, K. Hofmann, M. Glesner: CAD, CAT and MPW for MEMS, SASIMI'98, Workshop on Synthesis and System Integration of Mixed Technologies, Tohoku University, Sendai, Japan, 19-20, Oct. 1998. Proc. pp. 207-219

V. Székely, M. Rencz, B. Courtois: Thermal transient testing of packages without a tester. IMAPS'98, San Diego, California, Nov. 1-4, 1998

V. Székely, M. Rencz, S. Török, G. Végh, Zs. Benedek, Cs. Márta, J. Mizsei: Advances in the thermal measurement and evaluation technics, 4th Therminic Workshop, Sept. 27-29, 1998, Cannes, Proceedings pp. 5-10.

V. Székely, A. Poppe, M. Rencz, A. Páhi, Sz. Hajder, G. Hajas: Structural and Algorithmic Questions of a Platform Independent Electro-Thermal Simulator, 4th Therminic Workshop, Sept. 27-29, 1998, Cannes, Proceedings, pp. 121-126.

A. Morrissey, J. Alderman, G. Kelly, Zs. Kohári, A. Páhi, M. Rencz: 3D Packaging of a Microsystem with Special Thermal Constraints, 4th Therminic Workshop, Sept. 27-29, 1998, Cannes, Proceedings, pp. 171-174

A. Páhi, V. Székely, M. Rosenthal, M. Rencz: 3D extension of the SUNRED field solver, 4th Therminic Workshop, Sept. 27-29, 1998, Cannes, Proceedings, pp. 185-190

G. Hajas, L. Lipták-Fegó: Characterization of Submicron Bulk and SOI MOS Transistors for Electrothermal and Logi-thermal Simulation, 4th Therminic Workshop, Sept. 27-29, 1998, Cannes, Proceedings, pp. 31-34

V. Székely, M. Rencz, Cs. Márta, B. Courtois: Thermal monitoring through boundary scan, MCM Test V Advanced Technology Workshop, Napa Valley, CA, Sept. 20-23, 1998, USA - pp.

V. Székely: Thermal Monitoring of PC Boards with In-chip Thermal Test Circuitry, To be published in Future Circuits International in 1998

V. Székely, M. Rencz, S. Török, B. Courtois: I_DDQ Testing of Submicron CMOS by Cooling. ATS'98, The Seventh Asian Test Symposium, Dec. 2-4, 1998, Singapore, Proceedings, pp. 1-6

V. Székely, M. Rencz, B. Courtois: Thermal transient testing of packages without a testter. EPTC'98, Dec. 8-10, 1998, Singapore, Proceedings, pp. 236-239

V. Székely, M. Rencz, B. Courtois: Thermal testing methods to increase system reliability. In Proceedings of SEMI-THERM, Semiconductor Thermal Measurement and Management Symposium, January 28-30, 1997 Austin, Texas, USA, pp. 210-217

V. Székely, A. Páhi, A. Poppe, M. Rencz, A. Csendes: SISSI - a tool for dynamic electro-thermal simulation of analog VLSI cells, European Design & Test Conference'97, 17-20 March 1997, Paris, France, p. 617

V. Székely, M. Rencz, B. Courtois: Integrating on-chip temperature sensors into DfT schemes and BIST architectures, In Proceedings of the 15th IEEE VLSI Test Symposium, Monterey, Ca, USA, Apr. 27-30, 1997, pp. 440-446

J.M. Karam, B. Courtois, H. Boutamine, P. Drake, A. Poppe, V. Székely, M. Rencz, K. Hofmann, M. Glesner: CAD and Foundries for Microsystems, 34th Design Automation Conference, Anaheim California, June 9-13, 1997, pp. 674-679

J.M. Karam, B. Courtois, H. Boutamine, P. Drake, A. Poppe, V. Székely, M. Rencz, K. Hofmann, M. Glesner: CAD and Foundries for Microsystems, In Proceedings of the 34th Design Automation Conference, Anaheim California, June 9-13, 1997, pp. 674-679

K. Tarnay, A. Gali, A. Poppe, T. Kocsis, F. Masszi: Examination of MOS Structures by a 3D Particle Dynamics Monte Carlo Simulator Including Electrothermal Effect, 17th Nordic Semiconductor Meeting, Trondheim, 1996 jun. 17-20

J. Mizsei, V. Lantto, AFM and STM studies of ultra-thin metal deposits on sputtered tin-oxide surfaces, 17th Nordic Semiconductor Meeting, Trondheim, Norway, June 17-20, 1996.

F. Kovács et al.: Telemonitoring of gestation by FHR measurements using acoustical signal evaluation, Medicine 2001 Conf., Montreal, 19-24. June 1996.

J.M. Karam, B. Courtois, K. Hoffmann, M. Glesner, A. Poppe, M. Rencz, V. Székely: Applied design and analysis of microsystems. In Proceedings of EDAC-ETC-ASIC European Design and Test Conference, 11-14 March 1996, Paris, France, pp 528-532

V. Székely, A. Poppe, M. Rencz, G. Farkas, A. Csendes, A. Páhi: An efficient method for the self-consistent electro-thermal simulation and its integration into a CAD framework. In Proceedings of EDAC-ETC-ASIC European Design and Test Conference, 11-14 March 1996, Paris, France, p. 604

V. Székely, Zs. Kohári, Cs. Márta, M. Rencz, B. Courtois: Test Structure for Thermal Monitoring. IEEE International Conference on Microelectronics Test Structures, March 26-28, 1996, Trento, Italy, pp. 111-115

J. M. Karam, B. Courtois, K. Hofmann, A. Poppe, M. Rencz, M. Glesner, V. Székely: Microsystems Modeling at System Level. Third Asia Pacific Conference on Hardware Description Languages, January 8-10 1996, Bangalore, India, pp. 34-39

V. Székely, A. Kowalczyk: The Role of Thermal Transient Measurements in MST. II International NEXUSEAST/NEXUSPAN Workshop on Microsystem Technology. Szczyrk, Poland, 16-18 May, 1996, pp. 56-61

V. Székely, A. Páhi, A. Poppe, M. Rencz: Electro-Thermal Simulation of ICs Based on the Electricaland Thermal Netlist Extracted from the Layout 3rd Advanced Training Course: Mixed Design of Integrated Circuits and Systems, Lodz, Poland, 30 May - 1 June, 1996, pp. 250-255

V. Székely, M. Rencz, B. Courtois: Thermal monitoring of memories. 1996 IEEE International Workshop on Memory Technology, Design and Testing. August 13-14, 1996, Singapore, pp. 86-91

V. Székely, M. Rencz, J.M. Karam, M. Lubaszewski, B. Courtois: Thermal monitoring of self-checking systems. 2nd IEEE International On-Line Testing Workshop, July 8-10, 1996, Biarritz - Saint-Jean-de-Luz, France, pp. 6-12

V. Székely, M. Rencz, B. Courtois: Thermal transient testing of he quality of encapsulation. MCM Test Workshop, September 15-18, 1996, Napa, California, pp. 25-31

V. Székely, A. Csendes, M. Rencz: m S-THERMANAL: An efficient thermal simulation tool for microsystem elements and MCM's. THERMINIC Workshop'96, 25-27 September, 1996 Budapest, pp. 13-20

V. Székely: THERMODEL: a tool for compact dynamic thermal model generation. THERMINIC Workshop'96, 25-27 September, 1996 Budapest, pp. 21-26.

V. Székely, Cs. Márta, Zs. Kohári, M. Rencz: New temperature sensors for DfTT applications. THERMINIC Workshop'96, 25-27 September, 1996 Budapest, pp. 49-55

V. Székely, A. Poppe, A. Páhi, A. Csendes, G. Hajas, M. Rencz: Electro-thermal and logi-thermal simulation of VLSI designs. THERMINIC Workshop'96, 25-27 September, 1996 Budapest, pp. 79-88.

V. Székely: Thermal investigations of microsystems. In Proceedings of the Baltic Electronics Conference, Oct. 7-11. 1996, Tallinn. pp. 29-36.

V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing. In Proceedings of the 29th International Symposium on Microelectronics, Minneapolis, Minnesota, USA, 6-10 October, 1996, pp. 18-23

J. M. Karam, B. Courtois, M. Rencz, A. Poppe, V. Székely: Microsystem Design Framework based on Tool Adaptations and Library Developments. SPIE'96 Symposium on Micromachining and Microfabrication, 14-15 October 1996, Austin, Texas USA, SPIE Proc. Vol. 2880, pp. 236-245

J.M. Karam, B. Courtois, K. Hofmann, A. Poppe. M. Rencz, M. Glesner, V. Székely: CAD of MEMS: from the idea to the reality. In Proceedings of France-Japan/Europe - Asia Congress on Mechatronics, Besancon October 1-3, 1996. pp. 70-76

V. Székely, M. Rencz, J.M. Karam, M. Lubaszewski, B. Courtois: Thermal monitoring of safety-critical integrated systems. In Proceedings of The Fifth Asian Test Symposium (ATS'96) November 20-22, 1996. Hsinchu, Taiwan, Proceedings pp. 282-288

V. Székely, A. Csendes, M. Rencz: uS-THERMANAL: An efficient thermal simulation tool for microsystem elements and MCM's. SPIE'96 Symposium on Micromachining and Microfabrication, 14-15 October 1996, Austin, Texas USA, SPIE Proc. Vol. 2880, pp. 64-75.

Z. Lábadi, I. Habermajer, V. Rakovics and A.L. Tóth: Wave guiding Interfaces Between LPE Grown Multilayer, Lecture presented at the 'Semiconductor and Integrated Optoelectronics' (SIOE '95) Conference; University of Wales, Cardiff, 27-29 March 1995.

I. Habermajer:Analysis of Composite-Cavity Semiconductor Lasers by Network-Theoretical Concept. 'Semiconductor and Integrated Optoelectronics' (SIOE '95) Conference; University of Wales, Cardiff, 27-29 March 1995.