V. Székely, P. G. Szabó
Blind tracing of mechanical movement in electrostatic MEMS structures.
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING 71:(1) pp. 11-21. (2012)IF*, WoS linkScopus link Dokumentum a kiadónál10.1007/s10470-010-9551-z []

Székely Vladimír, Szalai Albin
Measurement of the Time-Constant Spectrum: Systematic Errors, Correction.
MICROELECTRONICS JOURNAL 43:(11) pp. 904-907. (2012)IF*, WoS linkScopus link Dokumentum a kiadónál10.1016/j.mejo.2012.05.011 []

Szalai Albin, Czirkos Zoltán, Székely Vladimír
A quasi-SPICE electro-thermal simulator.
In: Proceedings of the 18th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'12). Budapest, Magyarország, 2012.09.25-2012.09.27. pp. 190-195. Scopus linkTeljes dokumentum []

P. G. Szabó, V. Székely
Crosstalk Compensation in Thermal Transient Measurements.
INFOCOMMUNICATIONS JOURNAL III: pp. 9-14. (2012)Scopus link []

Ender Ferenc, Székely Vladimír
Thermal Transfer Impedance Variations by Forced Convective Heat Transfer in Microchannels.
In: Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'12). Cannes, Franciaország, 2012.04.25-2012.04.27. Cannes: pp. 119-124. Paper Special session of BIO-MEMS. ISBN: 978-2-35500-020-1 WoS link []

Vass-Varnai A, Szekely V, Sarkany Z, Rencz M
New level of accuracy in TIM measurements.
In: Proceedings of the 27th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'11). San Jose, Amerikai Egyesült Államok, 2011.03.20-2011.03.24. pp. 317-324. ISBN: 978-1-61284-734-4 Kötet megjegyzések: CD version ISBN: 978-1-61284-735-1KivonatWoS linkScopus link10.1109/STHERM.2011.5767218Adatbázis-linkek: IEEE Xplore link []

V Székely, A Szalai
Measurement of the time-constant spectrum: systematic errors, correction.
In: Proceedings of the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'11). Paris, Franciaország, 2011.09.27-2011.09.29. pp. 45-48. Adatbázis-linkek: Scopus link []

Székely Vladimír, Kollár Ernő, Somlay Gergely, Szabó Péter Gábor, Juhász László, Rencz Márta, Vass-Várnai András
Statikus TIM teszter tervezése.
HÍRADÁSTECHNIKA LXVI:(1) pp. 37-46. (2011) Dokumentum a kiadónál []

Péter G. Szabó, Vladimír Székely
Investigation of parallel heat flow path in electro-thermal microsystems.
MICROSYSTEM TECHNOLOGIES 17:(4) pp. 533-541. (2011)IF, WoS linkScopus link Dokumentum a kiadónál10.1007/s00542-011-1224-z []

Albin Szalai, Vladimír Székely
Possible acception criteria for structure functions.
MICROELECTRONICS JOURNAL 43:(2) pp. 164-168. (2011)IF, WoS link Dokumentum a kiadónál10.1016/j.mejo.2011.08.010Adatbázis-linkek: DOI linkScienceDirect linkScopus link []

V. Székely, E. Kollár, G. Somlay, P. G. Szabó, M. Rencz
Design of a Static TIM Tester.
JOURNAL OF ELECTRONIC PACKAGING 132:(1) 9 p. Paper 011001. (2010)IF, WoS link Dokumentum a kiadónál10.1115/1.4000715Adatbázis-linkek: Scopus linkGoogle scholar link []

V. Székely, P. G. Szabó
Blind Tracing of Mechanical Movement in Electro-static MEMS Structures.
In: Bernard Courtois, Jean-Michel Karam, Ryutaro Maeda, Pascal Nouet, Peter Schneider, Hsiharng Yang (szerk.)Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP'10). Sevilla, Spanyolország, 2010.05.05-2010.05.07. pp. 39-43. ISBN: 978-2-35500-011-9 Dokumentum a kiadónál []

Szalai A, Székely V
How do we know if a structure function is correct?: Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on.
In: Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10). Barcelona, Spanyolország, 2010.10.06-2010.10.08. Barcelona: pp. 80-83. ISBN: 978-2-35500-012-6 Scopus link Dokumentum a kiadónál []

Péter G. Szabó, Vladimír Székely
Investigation of Parallel Heat-flow Path in Electro-thermal Microsystems.
In: Bernard Courtois, Jean-Michel Karam, Ryutaro Maeda, Pascal Nouet, Peter Schneider, Hsiharng Yang (szerk.)Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP'10). Sevilla, Spanyolország, 2010.05.05-2010.05.07. pp. 215-220. ISBN: 978-2-35500-011-9 Dokumentum a kiadónál []

Péter G. Szabó, Vladimír Székely
Crosstalk Compensation in Thermal Transient Measurements.
In: Proceedings of the 16th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'10). Barcelona, Spanyolország, 2010.10.06-2010.10.08. pp. 24-27. Paper 36. ISBN: 978-2-35500-012-6 Scopus link Dokumentum a kiadónálTeljes kötetTeljes kötetTeljes kötet []

László Pohl, Zsolt Kohári, Vladimír Székely
Fast field solver for the simulation of large area OLEDs.
MICROELECTRONICS JOURNAL 41:(9) pp. 566-573. (2010)IF, WoS link Dokumentum a kiadónál10.1016/j.mejo.2009.12.007Adatbázis-linkek: Scopus linkWoS linkGoogle scholar linkScienceDirect linkDOI link []

F Ender, H Sántha, V Székely
Optimization of microfluidic flow sensors for different flow ranges by FEM simulation.
In: Proceedings of 33rd International Spring Seminar on Electronics Technology: "Polymer Electronics and Nanotechnologies: towards System Integration". Warszawa, Lengyelország, 2010.05.12-2010.05.16. Warszawa: ISSE, pp. 308-313. Scopus linkTeljes dokumentum10.1109/ISSE.2010.5547309Adatbázis-linkek: Google scholar hash link []

Poppe A, Yan Zhang, Wilson J, Farkas G, Szabo P, Parry J, Rencz M, Szekely V
Thermal measurement and modeling of multi-die packages.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 32:(2) pp. 484-492. (2009)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/TCAPT.2008.2004578Adatbázis-linkek: Google scholar linkGoogle scholar hash link []

Péter Gábor Szabó, Vladimír Székely
Characterization and modeling of electro-thermal MEMS structures.
MICROSYSTEM TECHNOLOGIES 15:(8) pp. 1293-1301. (2009)IF, WoS linkScopus link Dokumentum a kiadónál10.1007/s00542-009-0845-yAdatbázis-linkek: Google scholar linkGoogle scholar hash link []

M. Rencz, V. Székely, G. Somlay, P. Szabó, E. Kollár
A Sophisticated Method for Static Testing of TIM.
In: Proceedings of the ASME 2009 InterPACK Conference. San Francisco, Amerikai Egyesült Államok, 2009.07.19-2009.07.23. pp. 1-7. Paper IPACK2009-89363. WoS link []

György Bognár, Z. Szűcs, V. Székely, M. Rencz
Contactless thermal characterization of high temperature test chamber.
MICROSYSTEM TECHNOLOGIES 8:(15) pp. 1279-1285. (2009)IF, WoS linkScopus link Dokumentum a kiadónál10.1007/s00542-008-0759-0Adatbázis-linkek: Google scholar link []

Ender F, Sántha H, Székely V
Flow Sensor for Microfluidic Applications - Based on Standard PWB Technology.
In: Proc. of the 32nd International Spring Seminar on Electronics Technology. Brno, Csehország, 2009.05.13-2009.05.17. (IEEE)pp. 322-323 . WoS linkTeljes dokumentumAdatbázis-linkek: Google scholar linkGoogle scholar hash link []

Z. Szűcs, Gy. Bognár, V. Székely, M. Rencz
Contactless Thermal Characterization of High Temperature Test Chamber.
In: Victor M Bright, Tarik Bourouina, Bernard Courtois, Marc Desmulliez, Jean Michel Karam, Gou-Jen Wang (szerk.)Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'08). Nice, Franciaország, 2008.04.09-2008.04.11. pp. 345-349. ISBN: 978-2-35500-006-5 WoS linkScopus linkTeljes dokumentum10.1109/DTIP.2008.4753015Teljes kötetTeljes kötetTeljes kötet []

Vladimír Székely
Evaluation of short pulse thermal transient measurements.
In: Proceedings of the 14th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'08). Rome, Olaszország, 2008.09.24-2008.09.26. pp. 20-25. WoS linkScopus linkTeljes dokumentum10.1109/THERMINIC.2008.4669872Adatbázis-linkek: Google scholar linkGoogle scholar hash link []

V. Székely, G. Somlay, P. G. Szabó, M. Rencz
Design of a static TIM tester.
In: Proceedings of the 14th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'08). Rome, Olaszország, 2008.09.24-2008.09.26. pp. 132-136. WoS linkScopus linkTeljes dokumentum10.1109/THERMINIC.2008.4669894Adatbázis-linkek: Google scholar linkGoogle scholar hash link []

P. G. Szabó, V. Székely
Characterization and Modeling of an Electro-thermal MEMS Structure.
In: Victor M Bright, Tarik Bourouina, Bernard Courtois, Marc Desmulliez, Jean Michel Karam, Gou-Jen Wang (szerk.)Collection of Papers Presented at the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'08). Nice, Franciaország, 2008.04.09-2008.04.11. pp. 350-354. ISBN: 978-2-35500-006-5 WoS linkScopus linkTeljes dokumentum10.1109/DTIP.2008.4753016Teljes kötetTeljes kötetTeljes kötet []

A Poppe, M Rencz, V Székely
Teaching microelectronics at BME to many hundred BSc students with an emphasis on thermal issues.
In: Proceedings of EWME 2008 - the 7th European Workshop on Microelectronics Education. Budapest, Magyarország, 2008.05.28-2008.05.30. pp. 62-63. ISBN: 978-2-35500-007-2 Teljes dokumentum Dokumentum a kiadónálTeljes kötetTeljes kötetTeljes kötet []

A Poppe, Gy Horváth, G Nagy, M Rencz, V Székely
Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits.
In: Proceedings of the 24th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'08). San Jose, Amerikai Egyesült Államok, 2008.03.16-2008.03.20. pp. 68-76. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/STHERM.2008.4509369Adatbázis-linkek: Google scholar linkGoogle scholar hash link []

Székely V, Török S, Kollár E
Improvements of the variable thermal resistance.
In: Proceedings of the 13th International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'07). Budapest, Magyarország, 2007.09.17-2007.09.19. (13)pp. 180-183. ISBN: 978-2-35500-002-7 WoS linkScopus linkTeljes dokumentum10.1109/THERMINIC.2007.4451773 []

Rencz M, Szekely V, Poppe A
A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 30:(3) pp. 367-374. (2007)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/TCAPT.2007.901740Adatbázis-linkek: Google scholar link []

Poppe A, Farkas G, Parry J, Szabó P, Rencz M, Székely V
DELPHI Style Compact Modeling of Stacked die Packages.
In: Proceedings of the 23rd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07). San Jose, Amerikai Egyesült Államok, 2007.03.18-2007.03.22. IEEE, pp. 248-254. ISBN: 1-4244-09589-4 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2007.352431Adatbázis-linkek: Google scholar link []

M Rencz, V Székely, B Courtois
Die attach quality testing by structure function evaluation.
In: Ephraim Suhir, Y C Lee, C P WongMicro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, 2007. pp. 629-650.  978-0-387-27974-9Amazon keresőGoogle keresőCopac ISBN: 978-0-387-27974-9 []

Kohári Zs, Bognár Gy, Horváth Gy, Poppe A, Rencz M, Székely V
Cross-verification of Thermal Characterization of a Microcooler.
JOURNAL OF ELECTRONIC PACKAGING 129:(2) pp. 167-171. (2007)IF, WoS linkScopus link Dokumentum a kiadónál10.1115/1.2721089Adatbázis-linkek: Google scholar link []

13th International Workshop on Thermal Investigation of ICs and Systems.
Budapest, Magyarország, 2007.09.17-2007.09.19.2007. []

B. Németh, P. G. Szabó, V. Székely
Design, Simulation and Measurements of MEMS Test Structures.
In: Proceedings of the 6th Electronic Circuits and Systems Conference (ECS'07). Bratislava, Szlovákia, 2007.09.06-2007.09.07. pp. 49-54. []

V Székely, G Mezősi
Design issues of a variable thermal resistance.
In: Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06). Nice, Franciaország, 2006.09.27-2006.09.29. pp. 186-190. []

Szabó P, Poppe A, Farkas G, Szekely V, Courtois B, Rencz M
Thermal Characterization and Compact Modeling of Stacked die Packages.
In: Proceedings of The 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM'06). San Diego, Amerikai Egyesült Államok, 2006.05.30-2006.06.02. (2006)pp. 251-257. ISBN: 0-7803-9524-7 WoS linkScopus link Dokumentum a kiadónál10.1109/ITHERM.2006.1645350Adatbázis-linkek: Google scholar link []

Maák P, Takács T, Barócsi A, Kollár E, Székely V, Richter P
Refractive index nonuniformities in acousto-optic devices due to heat production by ultrasound.
OPTICS COMMUNICATIONS 266:(2) pp. 419-425. (2006)IF, WoS linkScopus linkTeljes dokumentum10.1016/j.optcom.2006.05.072 []

L Pohl, V. Szekely
A more flexible realization of the SUNRED algorithm.
In: B Courtois, M Rencz, C Lasance, V SzekelyProceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06). Nice, Franciaország, 2006.09.27-2006.09.29. pp. 96-100. ISBN: 2-916187-04-9 Dokumentum a kiadónálTeljes kötetTeljes kötetTeljes kötetAdatbázis-linkek: Google scholar link []

Kollár E, Székely V
Reducing the possibility of subjective error in the determination of the structure-function-based effective thermal conductivity of boards.
In: Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06). Nice, Franciaország, 2006.09.27-2006.09.29. (12)pp. 28-32. Teljes dokumentum []

György Bognár, Gyula Horváth, Zoltán Szűcs, Vladimír Székely
Die attach quality testing by fully contactless measurement method.
In: Proceedings of the 9 th IEEE Workshop on Design and Diagnostics of Electronic Circuits and Systems (DDECS'06). Prága, Csehország, 2006.04.14-2006.04.18. pp. 79-80. Dokumentum a kiadónál10.1109/DDECS.2006.1649578Adatbázis-linkek: WoS linkScopus linkGoogle scholar link []

Gy Bognar, V Szekely, M Rencz
Contactless thermal characterization method of PCB-s using an IR sensor array.
In: B Courtois, M Rencz, C Lasance, V SzekelyProceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06). Nice, Franciaország, 2006.09.27-2006.09.29. pp. 48-53. ISBN: 2-916187-04-9 Teljes dokumentumTeljes kötetTeljes kötetTeljes kötet []

Gy Bognár, V Székely, M Rencz
Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array.
In: S Blanton, A Bosseboeuf, B Courtois, J-M Karam, V Kempe (szerk.)Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'06). Stresa, Lago Maggiore, Olaszország, 2006.04.26-2006.04.28. pp. 154-158. ISBN: 2-916187-03-0 WoS linkTeljes dokumentumTeljes kötetTeljes kötetTeljes kötet []

Proceedings of the 12th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'06).
Nice, Franciaország, 2006.09.27-2006.09.29.2006. Teljes dokumentum []

A Poppe, G Farkas, V Székely, Gy Horváth, M Rencz
Multi-domain simulation and measurement of power LED-s and power LED assemblies.
In: Proceedings of the 22nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06). Dallas, Amerikai Egyesült Államok, 2006.03.14-2006.03.16. pp. 191-198. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/STHERM.2006.1625227Adatbázis-linkek: Google scholar link []

Zs Kohári, Gy Bognár, E Kollár, Gy Horváth, A Poppe, M Rencz, V Székely
Cross-Verification of Thermal Characterisation of a Micro-Cooler.
In: Proceedings of the 11th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'05). Belgirate, Olaszország, 2005.09.28-2005.09.30. pp. 263-264. Teljes dokumentum []

Szabó P, Rencz M, Szekely V, Poppe A, Farkas G, Courtois B
Thermal Characterization and Modeling of Stacked Die Packages.
In: Proceedings of the InterPACK'05. San Francisco, Amerikai Egyesült Államok, 2005.07.17-2005.07.22. pp. 1575-1581. Paper IPACK2005-73437. WoS linkTeljes dokumentum10.1115/IPACK2005-73437Adatbázis-linkek: Google scholar link []

Rencz M, Poppe A, Kollár E, Ress S, Szekely V
Increasing the accuracy of structure function based thermal material parameter measurements.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 28:(1) pp. 51-57. (2005)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/TCAPT.2004.843204Adatbázis-linkek: Google scholar link []

P Szabó, G Perlaky, Gy Bognár, Gy Horváth, S Ress, A Poppe, V Székely, M Rencz, B Courtois
Thermo-mechanical characterization and integrity checking of packages and movable-structures.
In: Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show (NANOTECH'05): Volume 3. Anaheim, Amerikai Egyesült Államok, 2005.05.08-2005.05.12. pp. 331-334. ISBN: 0-9767985-2-2 Scopus link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

P Szabó, M Rencz, V Székely, A Poppe, G Farkas, B Courtois
Thermal Modelling of Multiple Die Packages.
In: Proceedings of the 7th Electronics Packaging Technology Conference (EPTC'05): Volume Two. Singapore, Szingapúr, 2005.12.07-2005.12.09. pp. 521-525. WoS linkScopus link Dokumentum a kiadónál10.1109/EPTC.2005.1614459Adatbázis-linkek: Google scholar link []

Lasance C.J.M., Szekely V.
Foreword THERMINIC Special Section.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 28:(4) pp. 591-592. (2005)WoS linkScopus link10.1109/TCAPT.2005.861483 []

Gy. Horváth, Gy. Bognár, P. Szabó, S. Ress, A. Poppe, V. Székely, M Rencz
Novel non-contact measurement methods on semiconductor structures.
In: Proceedings of the International Conference Microtechnology and Thermal Problems in Electronics (MICROTHERM'05). Lodz, Lengyelország, 2005.06.19-2005.06.22. pp. 50-57. []

Gy Horváth, Gy Bognár, Zs Kohári, A J Pang, M P Y Desmulliez, A Poppe, V Székely, M Rencz
Thermal Characterisation of a Radial-Channel Micro-Cooler Plate.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'05). Montreux, Svájc, 2005.06.01-2005.06.03. pp. 227-232. Teljes dokumentumAdatbázis-linkek: Google scholar link []

Gy Bognár, Gy Horváth, Zs Kohári, A J Pang, M P Y Desmulliez, A Poppe, M Rencz, V Székely
Thermal Characterization of a Radial Micro-Channel Cooling Plate.
In: Proceedings of the 21st IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'05). San Jose, Amerikai Egyesült Államok, 2005.03.15-2005.03.17. pp. 135-140. ISBN: 0-7803-8985-9 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2005.1412169Adatbázis-linkek: Google scholar link []

G Perlaky, Gy Bognár, Z Szücs, P Szabó, Gy Horváth, A Poppe, V Székely, M Rencz
Thermal and Thermo-Mechanical Characterization of Movable-Structures and Their Packages.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'05). Montreux, Svájc, 2005.06.01-2005.06.03. pp. 233-238. Teljes dokumentumAdatbázis-linkek: Google scholar link []

Bognár G, Furjes P, Szekely V, Rencz M
Transient Thermal Characterisation of Hot Plates.
MICROSYSTEM TECHNOLOGIES 12:(1-2) pp. 154-159. (2005)IF, WoS linkScopus link Dokumentum a kiadónál10.1007/s00542-005-0002-1Adatbázis-linkek: Google scholar link []

Székely V., Bognár Gy., Rencz M., Ciontu F., Charlot B., Courtois B.
Design and Verification of an Electrostatic MEMS Simulator.
In: Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show (Nanotech'04): Volume 2. Boston, Amerikai Egyesült Államok, 2004.03.07-2004.03.11. (2)pp. 490-493. ISBN: 0-9728422-8-4 KivonatWoS linkScopus linkTeljes kötetTeljes kötetTeljes kötet []

Székely V, Poppe A, Hajas G
Electro-thermal Transistor Models in the Sissi Electro-thermal IC Simulator.
In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'04). Bruxelles, Belgium, 2004.05.10-2004.05.12. pp. 105-112. ISBN: 0-7803-8420-2 WoS linkScopus linkTeljes dokumentumAdatbázis-linkek: Google scholar link []

Rencz M, Farkas G, Székely V, Poppe A, Courtois B
Thermal Qualification of 3D Stacked die Packages.
In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC'04). Singapore, Szingapúr, 2004.12.08-2004.12.10. pp. 30-35. ISBN: 0-7803-8821-6 WoS linkScopus link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

Rencz M, Poppe A, Howard N, Szekely V, Courtois B, Zhang L, Nguyen L
Testing the die Attach Quality of 3D Stacked Dies.
In: Proceedings of the ASME International Mechanical Engineering Congress and Exposition (IMECE'04). Anaheim, Amerikai Egyesült Államok, 2004.11.13-2004.11.19. (4)pp. 249-256. Paper IMECE2004-62418. KivonatScopus linkAdatbázis-linkek: Google scholar link []

Rencz M, Szekely V
Structure Function Evaluation of Stacked Dies.
In: Proceedings of the 20th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'04). San Jose, Amerikai Egyesült Államok, 2004.03.09-2004.03.11. (20) IEEE, pp. 50-54. ISBN: 0-7803-8363-X WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2004.1291301 []

Rencz M, Kollár E, Székely V
Heat-flux Sensor to Support Transient Thermal Characterisation of IC Packages.
SENSORS AND ACTUATORS A-PHYSICAL 116:(2) pp. 284-292. (2004)IF, KivonatWoS linkScopus link10.1016/j.sna.2004.05.002Adatbázis-linkek: Google scholar link []

Rencz M, Szekely V, Courtois B, Zhang L, Howard N, Nguyen L
Die Attach Quality Control of 3D Stacked Dies.
In: Proceedings of the 29th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT'04). San Jose, Amerikai Egyesült Államok, 2004.07.14-2004.07.16. (29) IEEE, pp. 78-84. ISBN: 0-7803-8582-9 WoS linkScopus link Dokumentum a kiadónál10.1109/IEMT.2004.1321636 []

M. Rencz, V. Székely
Studies on the nonlinearity effects in dynamic compact model generation of packages.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 27:(1) pp. 124-130. (2004)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/TCAPT.2004.825750 []

M Rencz, V Székely, A Poppe
Results and issues in the measurements of 3D stacked die packages.
In: Proceedings of the 10th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'04). Sophia Antipolis, Franciaország, 2004.09.29-2004.10.01. pp. 137-144. []

M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois
Increasing the accuracy of structure function based evaluation of thermal transient measurements.
In: Proceedings of The 9th Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'04). Las Vegas, Amerikai Egyesült Államok, 2004.06.01-2004.06.04. pp. 85-90. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

M Rencz, V Székely, B Courtois
Die attach quality verification of packaged stacked dies.
In: &Packaging book.2004. p. &.   []

M Rencz, A Poppe, E Kollár, S Ress, V Székely, B Courtois
A procedure to correct the error in the structure function based thermal measuring methods.
In: Proceedings of the 20th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'04). San Jose, Amerikai Egyesült Államok, 2004.03.09-2004.03.11. pp. 92-97. WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2004.1291307Adatbázis-linkek: Google scholar link []

G Bognár, P Fürjes, V Székely, M Rencz
Transient thermal characterisation of hot plates.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'04). Montreux, Svájc, 2004.05.12-2004.05.14. pp. 401-406. []

E Kollár, V Székely, M Ádám, M Rencz
Integrated heat flux sensor array for the thermal investigation of IC packages.
In: Proceedings of Eurosensors XVIII. Roma, Olaszország, 2004.09.13-2004.09.15. pp. 758-759. []

E Kollár, V Székely, M Ádám, M Rencz
Heat-flux sensor array for package characterization.
In: Proceedings of the 10th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'04). Sophia Antipolis, Franciaország, 2004.09.29-2004.10.01. pp. 37-42. []

B Charlot, V Székely, M Rencz, G Bognar, B Courtois
An 8x8 Thermopile based uncooled infrared sensor.
In: Proceedings of European Micro and Nanosystems (EMNS'04). Paris, Franciaország, 2004.10.20-2004.10.21. pp. 131-135. []

V Székely, T Török
Verification of an electro-thermal simulation algorithm.
In: 9th Therminic Workshop. Aix-en-Provence, Franciaország, 2003.09.24-2003.09.26. pp. 233-238. []

Székely Vladimír
Distributed RC networks.
In: Wai-Kai Chen (szerk.)The Circuits and Filters Handbook. CRC Press LLC, 2003. pp. 1201-1222. (The electrical engineering handbook series) 0-8493-0912-3Amazon keresőGoogle keresőCopac ISBN: 0-8493-0912-3 []

Rencz M, Szekely V, Courtois B
Studies With Transient Compact Models of Packages and Heat Sinks.
In: Proceedings of InterPACK'03: ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1. Maui, Amerikai Egyesült Államok, 2003.07.06-2003.07.11. pp. 295-302. ISBN: 0-7918-3690-8 WoS linkScopus link []

Rencz M, Szekely V
Non-linearity Issues in the Dynamic Compact Model Generation.
In: Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03). San Jose, Amerikai Egyesült Államok, 2003.03.11-2003.03.13. IEEE, pp. 263-270. ISBN: 0-7803-7793-1 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2003.1194372 []

Rencz M, Székely V, Poppe A, Courtois B
Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems.
In: Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show (NANOTECH'03): Volume 2. San Francisco, Amerikai Egyesült Államok, 2003.02.23-2003.02.27. (2)pp. 476-479. ISBN: 0-9728422-1-7 WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

Rencz M, Farkas G, Poppe A, Székely V, Courtois B
A Methodology for the Generation of Dynamic Compact Models of Packages and Heat Sinks From Thermal Transient Measurements.
In: Proceedings of the 28th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT'03). San Jose, Amerikai Egyesült Államok, 2003.07.16-2003.07.18. IEEE, pp. 117-123. ISBN: 0-7803-7933-0 WoS linkScopus link Dokumentum a kiadónál10.1109/IEMT.2003.1225887Adatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Poppe, B Courtois
Electro-thermal simulation of MEMS elements.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'03). Cannes, Franciaország, 2003.05.05-2003.05.07. pp. 15-20. Kötet megjegyzések: Mandelieu-La NapouleWoS link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Poppe, K Torki, B Courtois
Electro-thermal simulation for the prediction of chip operation within the package.
In: Proceedings of the 19th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'03). San Jose, Amerikai Egyesült Államok, 2003.03.11-2003.03.13. pp. 168-175. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

M Rencz, G Farkas, V Székely, A Poppe, B Courtois
Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements.
In: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC'03). Singapore, Szingapúr, 2003.12.10-2003.12.12. pp. 479-484. ISBN: 0-7803-8205-6 WoS link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Poppe
A fast algorithm for the layout based electro-thermal simulation.
In: Wehn N, Verkest D (szerk.)Proceedings of the Design, Automation and Test in Europe Conference and Exhibition (DATE'03). Munich, Németország, 2003.03.03-2003.03.07. pp. 1032-1037. Vol. Vol. 1.ISBN: 0-7695-1870-2 WoS linkTeljes dokumentum Dokumentum a kiadónálTeljes kötetTeljes kötetTeljes kötetAdatbázis-linkek: Google scholar link []

L Pohl, V. Szekely
Developments of the SUNRED algorithm.
In: Proceedings of the 9th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'03). Aix-en-Provence, Franciaország, 2003.09.24-2003.09.26. pp. 197-200. Teljes dokumentumAdatbázis-linkek: Google scholar link []

Gy Bognár, V. Székely
Experiments for non-contact thermometry using laser interferometer.
In: Proceedings of the 9th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'03). Aix-en-Provence, Franciaország, 2003.09.24-2003.09.26. pp. 193-196. []

V Székely, M Rencz, A Poppe, G Farkas
User friendly tools for the thermal simulation and modeling of electronic subsystems.
In: Proceedings of the 3rd International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'02). Paris, Franciaország, 2002.04.15-2002.04.16. pp. 254-261. ISBN: 0-7803-9819-X []

V Székely, M Rencz
Studies on the non-linearity effects in dynamic compact model generation of packages.
In: Proceedings of the 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'02). Madrid, Spanyolország, 2002.10.01-2002.10.04. IEEE, pp. 10-16. []

V Székely, M Rencz, E Kollár, J Mizsei
Heat-flux sensor for the thermal measurement of IC packages.
In: Proceedings of the 8th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'02). Madrid, Spanyolország, 2002.10.01-2002.10.04. IEEE, pp. 83-89. []

Székely Vladimír
Enhancing reliability with thermal transient testing.
MICROELECTRONICS AND RELIABILITY 42:(4-5) pp. 629-640. (2002)IF, KivonatWoS linkScopus link10.1016/S0026-2714(02)00028-8Adatbázis-linkek: DOI link []

Székely Vladimír
Algorithmic solutions for thermal and electro-static simulation of MEMS,
In: Behringer FW, et al (szerk.)MEMS/MOEMS : Advances in photonic communications, sensing, metrology, packaging and assembly. Brugge, Belgium, 2002.10.28-2002.10.29. Bellingham: SPIE, pp. 159-173. (Proceedings of SPIE; vol. 4945.)ISBN: 0819447404 KivonatWoS linkScopus link10.1117/12.472702 []

Szekely V, Rencz M
Increasing the accuracy of thermal transient measurements.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 25:(4) pp. 539-546. (2002)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/TCAPT.2002.808002 []

Rencz M, Szekely V, Farkas G, Courtois B
Measuring Interface Thermal Resistance Values by Transient Testing.
In: Proccedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM'02). San Diego, Amerikai Egyesült Államok, 2002.05.30-2002.06.01. pp. 136-141. ISBN: 0-7803-7152-6 WoS linkScopus link Dokumentum a kiadónál10.1109/ITHERM.2002.1012449 []

Rencz M, Szekely V, Morelli A, Villa C
Determining Partial Thermal Resistances With Transient Measurements, and Using the Method to Detect die Attach Discontinuities.
In: Proceedings of the 18th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'02). San Jose, Amerikai Egyesült Államok, 2002.03.12-2002.03.14. IEEE, pp. 15-20. ISBN: 0-7803-7327-8 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2002.991340 []

Rencz M, Szekely V
Compact Dynamic Thermal Multiport Models of Packages for MEMS-package Co-simulation.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'02): Proceedings of SPIE Vol. 4755. Cannes, Franciaország, 2002.05.06-2002.05.08. pp. 415-423. WoS linkScopus link Dokumentum a kiadónál10.1117/12.425360 []

Rencz M, Szekely V, Courtois B
An Algorithm for the Inclusion of RC Compact Models of Packages Into Board Level Thermal Simulation Tools.
In: Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems (Nanotech'02): Nanotech 2002 Vol. 1. San Juan, Amerikai Egyesült Államok, 2002.04.22-2002.04.25. pp. 612-615. ISBN: 0-9708275-7-1 Scopus link Dokumentum a kiadónál []

M. Rencz, V. Székely
Measuring partial thermal resistances in a heat-flow path.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 25:(4) pp. 547-553. (2002)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/TCAPT.2002.808003 []

M Rencz, V Székely, A Poppe
Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'02): Proceedings of SPIE Vol. 4755. Cannes, Franciaország, 2002.05.06-2002.05.08. pp. 36-43. WoS linkScopus link Dokumentum a kiadónál10.1117/12.462840Adatbázis-linkek: Google scholar link []

M Rencz, A Poppe, V Székely, B Courtois
Inclusion of RC compact models of packages into board level thermal simulation tools.
In: Proceedings of the 18th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'02). San Jose, Amerikai Egyesült Államok, 2002.03.11-2002.03.14. pp. 71-76. WoS linkTeljes dokumentum Dokumentum a kiadónál10.1109/STHERM.2002.991348 []

M Rencz, V Székely, A Poppe, B Courtois
Co-simulation of dynamic compact models of packages with the detailed models of printed circuit boards.
In: Proceedings of the 27th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT'02). San Jose, Amerikai Egyesült Államok, 2002.07.17-2002.07.18. pp. 285-290. WoS linkScopus link Dokumentum a kiadónál10.1109/IEMT.2002.1032768Adatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Poppe, B Courtois
An algorithm for the direct co-simulation of dynamic compact models of packages with the detailed thermal models of boards.
In: Proceedings of the 4th Electronics Packaging Technology Conference (EPTC'02). Singapore, Szingapúr, 2002.12.10-2002.12.12. pp. 293-298. ISBN: 0-7803-7435-5 WoS link Dokumentum a kiadónál10.1109/EPTC.2002.1185686Adatbázis-linkek: Google scholar link []

A Poppe, V Székely
Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures.
ELECTRONICS COOLING 8: pp. 10-18. (2002)Teljes dokumentumAdatbázis-linkek: Google scholar link []

V Székely, M Rencz, L Pohl
Novelties in the theory and practice of thermal transient measurements.
In: Proceedings of the 7th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'01). Paris, Franciaország, 2001.09.24-2001.09.27. pp. 239-244. []

V Székely, É Nikodémusz, L Pohl, M Rencz
New developments in thermal transient testing.
In: Proceedings of the 8th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES'01). Zakopane, Lengyelország, 2001.06.21-2001.06.23. pp. 265-270. ISBN: 83-87202-98-3 Kivonat []

Székely Vladimír
Nobel-díj információs technológiáért.
TERMÉSZET VILÁGA 132:(4) pp. 157-160. (2001) []

Székely Vladimír
Gyakorlati megoldások az elektronika termikus problémáira.
In: Hungelektro-Hungamat. Budapest, Magyarország, 2001.04.10-2001.04.12. pp. 41-48. []

Székely V, Rencz M, Poppe A, Courtois B
THERMODEL: A Tool for Thermal Model Generation, and Application for MEMS.
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING 29:(1-2) pp. 49-59. (2001)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1023/A:1011226213197Adatbázis-linkek: Google scholar link []

Szekely V, Torok S, Nikodemusz E, Farkas G, Rencz M
Measurement and Evaluation of Thermal Transients.
In: Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference (IMTC'01): Vol. 1.. Budapest, Magyarország, 2001.05.21-2001.05.23. (1) IEEE, pp. 210-215. ISBN: 0-7803-6646-8 WoS linkScopus link Dokumentum a kiadónál10.1109/IMTC.2001.928814 []

Szekely V, Rencz M
Editorial.
MICROELECTRONICS JOURNAL 32:(10-11) pp. 795-796. (2001)WoS link Dokumentum a kiadónál10.1016/S0026-2692(01)00064-7 []

Szekely V, Rencz M, Torok S, Ress S
Calculating Effective Board Thermal Parameters From Transient Measurements.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 24:(4) pp. 605-610. (2001)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/6144.974947 []

Rencz M, Szekely V, Poppe A, Farkas G, Courtois B
New Tools and Methods for the Thermal Transient Testing of Packages.
In: Proceedings of the International Conference on High-Density Interconnect and Systems Packaging: Proceedings of SPIE Vol. 4428. Santa Clara, Amerikai Egyesült Államok, 2001.04.17-2001.04.20. (4428)pp. 268-273. WoS linkScopus link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

Rencz M, Szekely V
Dynamic Thermal Multiport Modeling of IC Packages.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 24:(4) pp. 596-604. (2001)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/6144.974946 []

Rencz M, Szekely V
A Generic Method for Thermal Multiport Model Generation of IC Packages.
In: Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01). San Jose, Amerikai Egyesült Államok, 2001.03.20-2001.03.22. IEEE, pp. 145-152. ISBN: 0-7803-6649-2 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2001.915164 []

Poppe A, Farkas G, Rencz M, Benedek Zs, Pohl L, Székely V, Torki K, Mir S, Courtois B
Design Issues of a Multi-functional Intelligent Thermal Test Die.
In: Proceedings of the 17th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'01). San Jose, Amerikai Egyesült Államok, 2001.03.20-2001.03.22. pp. 50-57. ISBN: 0-7803-6649-2 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.2001.915144Adatbázis-linkek: Scopus linkWoS linkIEEE Xplore linkGoogle scholar link []

M Rencz, V Székely, B Courtois
Uncovering die attach problems with the help of thermal transient measurements.
In: Proceedings of SEMICON West 2001. San Jose, Amerikai Egyesült Államok, 2001.07.18-2001.07.20. pp. 63-76. []

M Rencz, V Székely, A Poppe, G Farkas, B Courtois
New methods and supporting tools for the thermal transient testing of packages.
In: Proceedings of the International Conference on Advances in Packaging (APACK'01). Singapore, Szingapúr, 2001.12.05-2001.12.07. pp. 407-411. ISBN: 981-04-4638-1 Teljes dokumentumAdatbázis-linkek: Google scholar link []

M Rencz, V Székely
Determining partial thermal resistances in a heat flow path with the help of transient measurements.
In: Proceedings of the 7th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'01). Paris, Franciaország, 2001.09.24-2001.09.27. pp. 250-255. []

M Rencz, V Székely, B Courtois
A method for generating dynamic thermal multiport models of packages.
In: Yung-Cheng Lee (szerk.)Proceedings of InterPACK'01. Kauai, Amerikai Egyesült Államok, 2001.07.08-2001.07.13. pp. 1280-1288. []

Benedek Zs, Courtois B, Farkas G, Kollár E, Mir S, Poppe A, Rencz M, Székely V, Torki K
A Scalable Multi-functional Thermal Test Chip Family: Design and Evaluation.
JOURNAL OF ELECTRONIC PACKAGING 123:(4) pp. 323-330. (2001)IF, WoS linkScopus link Dokumentum a kiadónál10.1115/1.1389846Adatbázis-linkek: Google scholar link []

A Poppe, M Rencz, V Székely, G Mezei
Development of a platform independent electro-thermal simulator.
In: Proceedings of the 7th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'01). Paris, Franciaország, 2001.09.24-2001.09.27. pp. 275-280. Teljes dokumentum []

V Székely, A Poppe, M Rencz
User friendly thermal simulators for research and education.
In: Proceedings of the 23rd International Spring Seminar on Electronics Technology (ISSE'00). Balatonfüred, Magyarország, 2000.05.06-2000.05.10. pp. 106-110. []

V Székely, M Rencz, A Poppe, B Courtois
THERMODEL: A tool for thermal model generation, and application for MEMS packages.
In: Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP'00): Proceedings of SPIE Vol. 4019. Paris, Franciaország, 2000.05.09-2000.05.11. pp. 39-49. WoS linkScopus link Dokumentum a kiadónál10.1117/12.382288Adatbázis-linkek: Google scholar link []

V Székely, M Rencz, B Courtois
New tools for the thermal transient testing of packages and MCMs.
In: Proceedings of the 7th Annual KGD Packaging and Test Workshop. Napa Valley, Amerikai Egyesült Államok, 2000.09.10-2000.09.13. pp. 269-284. []

V Székely, G Farkas, É Nikodémusz, M Rencz, S Ress, S Török
New procedures for thermal transient testing.
In: Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00). Budapest, Magyarország, 2000.09.24-2000.09.27. pp. 15-19. []

V Székely, M Rencz, S Török, S Ress, B Vizy
Experiments on effective board thermal conductivity measurements.
In: Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00). Budapest, Magyarország, 2000.09.24-2000.09.27. pp. 26-30. []

Szekely V, Poppe A, Rencz M, Rosental M, Teszeri T
THERMAN: a Thermal Simulation Tool for IC Chips, Microstructures and PW Boards.
MICROELECTRONICS AND RELIABILITY 40:(3) pp. 517-524. (2000)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0026-2714(99)00249-8Adatbázis-linkek: Google scholar link []

Szekely V, Rencz M
Thermal Dynamics and the Time Constant Domain.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 23:(3) pp. 587-594. (2000)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/6144.868862 []

Szekely V, Nagy A, Torok S, Hajas G, Rencz M
Realization of an electronically controlled thermal resistance.
MICROELECTRONICS JOURNAL 31:(9-10) pp. 811-814. (2000)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0026-2692(00)00063-X []

Szekely V, Ress S, Poppe A, Torok S, Magyari D, Benedek Z, Torki K, Courtois B, Rencz M
New approaches in the transient thermal measurements.
MICROELECTRONICS JOURNAL 31:(9-10) pp. 727-733. (2000)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0026-2692(00)00051-3Adatbázis-linkek: Google scholar link []

Székely V, Poppe A, Rencz M
Algorithmic Extension of Thermal Field Solvers: the Time Constant Analysis.
In: Proceedings of the 16th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'00). San Jose, Amerikai Egyesült Államok, 2000.03.21-2000.03.23. pp. 99-107. ISBN: 0-7803-5916-X Scopus link Dokumentum a kiadónál10.1109/STHERM.2000.837068Adatbázis-linkek: Google scholar link []

Rencz M, Szekely V, Torok S, Torki K, Courtois B
IDDQ Testing of Submicron CMOS - by Cooling?
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS 16:(5) pp. 453-461. (2000)IF, WoS linkScopus link Dokumentum a kiadónál10.1023/A:1008364515030 []

Rencz M, Székely V, Poppe A, Courtois B
From MEMS to the Global Simulation of SoCs.
In: Bernard Courtois, Serge N Demidenko, Lee Y Lau (szerk.)Proceedings of the International Symposium on Microelectronics and Assembly (ISMA'00): Design, Modeling, and Simulation in Microelectronics; Proceedings of SPIE. Singapore, Szingapúr, 2000.11.27-2000.12.01. (4228) SPIE, pp. 9-20. WoS linkScopus link Dokumentum a kiadónál10.1117/12.405418Adatbázis-linkek: Google scholar link []

Rencz M, Szekely V
Editorial.
MICROELECTRONICS JOURNAL 31:(9-10) pp. 725-726. (2000)WoS linkTeljes dokumentum10.1016/S0026-2692(00)00050-1 []

Rencz M, Szekely V, Kohari Zs, Courtois B
A Method for Thermal Model Generation of MEMS Packages.
In: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems (MSM'00). San Diego, Amerikai Egyesült Államok, 2000.03.27-2000.03.29. pp. 209-212. ISBN: 0-9666135-7-0 WoS linkScopus link Dokumentum a kiadónál []

M. Rencz, V. Székely, Zs. Kohári, B. Courtois
Thermal Evaluation and Modelling of the SIP9 and SP10 Mems Packages.
In: Proceedings of the Intersociety Conference on Thermomechanical Phenomena in Electronic Systems (ITHERM'00). Las Vegas, Amerikai Egyesült Államok, 2000.05.23-2000.05.26. pp. 120-126. (1.)WoS linkScopus link10.1109/ITHERM.2000.866817 []

M Rencz, V Székely, Zs Kohári, B Courtois
Thermal evaluation and modelling of Mems packages.
In: Proceedings of the 4th 2000 IEMT/IMC Symposium. Tokyo, Japán, 2000.04.19-2000.04.21. pp. 326-331. []

M Rencz, V Székely, E Kollár
Measuring dynamic thermal multiport parameters of IC packages.
In: Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00). Budapest, Magyarország, 2000.09.24-2000.09.27. pp. 244-250. []

M Rencz, V Székely, A Poppe, B Courtois
Friendly tools for the thermal simulation of power packages.
In: Proceedings of the International Workshop on Integrated Power Packaging (IWIPP'00). Waltham, Amerikai Egyesült Államok, 2000.07.14-2000.07.15. pp. 51-54. ISBN: 0-7803-6437-6 Dokumentum a kiadónál10.1109/IWIPP.2000.885181Adatbázis-linkek: Google scholar link []

A Poppe, G Farkas, M Rencz, Zs Benedek, L Pohl, V Székely, K Torki, S Mir, B Courtois
Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and measurement data acquisition.
In: Proceedings of the 6th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'00). Budapest, Magyarország, 2000.09.24-2000.09.27. pp. 267-272. Teljes dokumentumAdatbázis-linkek: Google scholar link []

V. Székely, M. Rencz, B. Courtois
Tool and Method for the Thermal Transient Evaluation of Packages.
In: Proceedings of Asia Pacific Symposium on Microelectronics and MEMS: Design, Characterization, and Packaging for MEMS and Microelectronics; Proceedings of SPIE Vol. 3893. Gold Coast, Ausztrália, 1999.10.27-1999.10.29. (3893)pp. 94-103. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1117/12.368429 []

V. Székely, A. Páhi, M. Rencz
SUNRED, a new Field Solving Approach.
PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING 3680:(I) pp. 278-288. (1999)WoS linkScopus link10.1117/12.341211 []

V Székely, S Ress, A Poppe, S Török, D Magyari, Zs Benedek, B Courtois, M Rencz
Transient thermal measurements for dynamic package modeling: new approaches.
In: Proceedings of the 5th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'99). Rome, Olaszország, 1999.10.03-1999.10.06. pp. 7-11. Teljes dokumentumAdatbázis-linkek: Google scholar link []

V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
THERMAN: a thermal-simulation tool for IC chips, microstructures and PW boards.
In: Proceedings of the 6th International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES'99). Krakow, Lengyelország, 1999.06.17-1999.06.19. pp. 331-336. ISBN: 83-87202-37-1 Kivonat []

V Székely, M Rencz, B Courtois
Thermal Transient Evaluation of Packaging with the TTMK Toolkit.
In: Agonafer D, Masumi Saka, Yung-Cheng Lee (szerk.)Proceedings of the InterPACK'99. Maui, Amerikai Egyesült Államok, 1999.06.13-1999.06.19. pp. 2199-2206. Kivonat []

V Székely, A Páhi, A Poppe, M Rosental, T Teszéri, M Rencz
Thermal time constant analysis and implementation in the THERMAN and SUNRED thermal simulation tools.
In: Proceedings of the 5th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'99). Rome, Olaszország, 1999.10.03-1999.10.06. pp. 343-348. []

V Székely, M Rencz, B Courtois
Thermal Investigations of ICs and Microstructures.
In: A. Kent, J.G. WilliamsEncyclopedia of Microcomputers. Marcel Dekker Inc, 1999. pp. 361-389. (Encyclopedia of Microcomputers)Vol. 23. Suppl. 2..  []

V Székely, A Páhi, M Rosenthal, M Rencz
SUNRED: a field solver and compact model generator tool based on successive mode reduction.
In: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems (MSM'99). San Juan, Amerikai Egyesült Államok, 1999.04.19-1999.04.21. pp. 342-345. ISBN: 0-9666135-4-6 WoS link Dokumentum a kiadónál []

V Székely, M Rencz, B Courtois
Simulation, testing and modeling of the thermal behavior and electro-thermal interactions in ICs, MCMs and PCBs.
In: Proceedings of the IEEE 1999 Southwest Symposium on Mixed-Signal Design (SSMSD'99). Tucson, Amerikai Egyesült Államok, 1999.04.11-1999.04.13. pp. 168-173. ISBN: 0-7803-5510-5 WoS link Dokumentum a kiadónál10.1109/SSMSD.1999.768612 []

V Székely, M Rencz, A Poppe, B Courtois
New Way for Thermal Transient Testing.
In: Proceedings of the 15th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'99). San Diego, Amerikai Egyesült Államok, 1999.03.09-1999.03.11. San Jose: pp. 182-188. ISBN: 0-7803-4486-3 WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/STHERM.1999.762446Adatbázis-linkek: Google scholar link []

V Székely, A Nagy, S Török, G Hajas, M Rencz
Heat sinks with controlled thermal resistance: an experiment.
In: Proceedings of the 5th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'99). Roma, Olaszország, 1999.10.03-1999.10.06. pp. 249-251. []

Székely Vladimír, Székelyné Nikodémusz Éva
THERMAN: termikus szimulációs program nyomtatott panelok és IC-struktúrák vizsgálatára.
ELEKTRONET VIII:(5) pp. 28-32. (1999) []

Székely Vladimír
Restoration of physical structures: an approach based on the theory of RC networks.
In: Beccari C (szerk.)Proceedings of the European conference on Circuit theory and design : ECCTD 99: 29 August-2 September 1999, Stresa, Italy. Stresa, Olaszország, 1999.08.29-1999.09.02. Torino: Levrotto & Bella - Politecnico di Torino, Dipartimento di elettronica, pp. 1131-1134. []

Szekely V, Rencz M, Pahi A, Courtois B
Thermal Monitoring and Testing of Electronic Systems.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 22:(2) pp. 231-237. (1999)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/6144.774737 []

Szekely V, Rencz M
Image Processing Procedures for the Thermal Measurements.
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 22:(2) pp. 259-265. (1999)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/6144.774742 []

Szekely V, Pahi A, Poppe A, Rencz M
Electro-Thermal Simulation with the SISSI Package.
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING 21:(1) pp. 21-31. (1999)IF, WoS linkScopus link Dokumentum a kiadónál10.1023/A:1008371625945Adatbázis-linkek: Google scholar link []

Szekely V, Rencz M, Courtois B
Application results of a new thermal benchmark chip.
In: Proceedings of the 15th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'99). San Diego, Amerikai Egyesült Államok, 1999.03.09-1999.03.11. San Jose: pp. 31-38. ISBN: 0-7803-4486-3 WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.1998.660384 []

Szekely V, Rencz M, Courtois B
A Step Forward in the Transient Thermal Characterization of Chips and Packages.
MICROELECTRONICS AND RELIABILITY 39:(1) pp. 89-96. (1999)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0026-2714(98)00198-X []

Rencz M, Szekely V, Courtois B
Editorial.
MICROELECTRONICS JOURNAL 30:(11) pp. 1083-1084. (1999)WoS linkTeljes dokumentum10.1016/S0026-2692(99)00068-3 []

M Rencz, V Székely, Zs Kohári, S Ress, A Poppe
Thermal evaluation of the SIP9 package.
In: Proceedings of the 5th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'99). Rome, Olaszország, 1999.10.03-1999.10.06. pp. 111-116. Teljes dokumentumAdatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Páhi, A Poppe
An alternative method for electro-thermal circuit simulation.
In: Proceedings of the Southwest Symposium on Mixed-Signal Design (SSMSD'99). Tucson, Amerikai Egyesült Államok, 1999.04.11-1999.04.13. pp. 117-122. ISBN: 0-7803-5510-5 WoS linkTeljes dokumentum Dokumentum a kiadónál10.1109/SSMSD.1999.768603Adatbázis-linkek: Google scholar link []

M Rencz, V Székely, A Páhi, A Poppe
Algorithmic and practical questions of electro-thermal circuit simulation.
In: Proceedings of Asia Pacific Symposium on Microelectronics and MEMS: Design, Characterization, and Packaging for MEMS and Microelectronics; Proceedings of SPIE Vol. 3893. Gold Coast, Ausztrália, 1999.10.27-1999.10.29. pp. 178-187. WoS linkScopus link Dokumentum a kiadónál10.1117/12.368423Adatbázis-linkek: Google scholar link []

Kerecsenné Rencz Márta, Székely V
Tapasztalatok az Európai kutatási projektekben való részvétellel kapcsolatban.
In: Műegyetem 2000 Konferencia. Budapest, Magyarország, 1999.01.20-1999.01.21. pp. 181-&. []

Courtois B, Karam J M, Mir S, Lubaszewski M, Szekely V, Rencz M, Hofmann K, Glesner M
Design and Test of MEMS.
In: Proceedings of the 12th International Conference on VLSI Design. Goa, India, 1999.01.07-1999.01.10. IEEE, pp. 270-275. ISBN: 0-7695-0013-7 WoS link Dokumentum a kiadónál10.1109/ICVD.1999.745160 []

A Poppe, Gy Csaba, K Tarnay, V Székely
Considering electro-thermal interactions in sub-micron n-MOS transistors on microscopic scale within a 3D particle dynamics based Monte Carlio simulator.
In: Proceedings of the 5th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'99). Rome, Olaszország, 1999.10.03-1999.10.06. pp. 134-137. Teljes dokumentum []

V Székely, M Rencz, Cs Márta, B Courtois
Various Aspects of the Design for Thermal Testability (DfTT).
In: Landrault C, Balado L (szerk.)Proceedings of the IEEE European Test Workshop (ETW'98). Barcelona, Spanyolország, 1998.05.27-1998.05.29. pp. 55-61. []

V Székely, M Rencz, B Courtois
Thermal Transient Testing Without a Tester.
In: Proceedings of SEMICON West 1998. San Jose, Amerikai Egyesült Államok, 1998.07.13-1998.07.17. pp. 1-10. []

V Székely, M Rencz, B Courtois
Thermal transient testing of packages without a tester.
In: Proceedings of the 31st International Symposium on Microelectronics: Proceedings of SPIE. San Diego, Amerikai Egyesült Államok, 1998.11.01-1998.11.04. Bellingham: SPIE-INT SOC OPTICAL ENGINEERING, p. &. Vol. 3582ISBN: 0-930815-52-1 WoS link []

V Székely, M Rencz, A Poppe, A Páhi, Sz Hajder
Thermal simulation tools for microsystem elements.
In: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems (MSM'98). Santa Clara, Amerikai Egyesült Államok, 1998.04.06-1998.04.08. pp. 463-468. Paper T366. ISBN: 0-96661-35-0-3 Teljes dokumentum []

V Székely, M Rencz, Cs Márta, B Courtois
Thermal monitoring through boundary scan.
In: Proceedings of IMAPS Advanced Technology Workshop on MCM Test V. Napa Valley, Amerikai Egyesült Államok, 1998.09.20-1998.09.23. p. &. []

V Székely, A Poppe, M Rencz, A Páhi, Sz Hajder, G Hajas
Structural and algorithmic questions of a platform independent electro-thermal simulator.
In: Proceedings of the 4th International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'98). Cannes, Franciaország, 1998.09.27-1998.09.29. pp. 121-126. WoS linkScopus linkTeljes dokumentumAdatbázis-linkek: Google scholar link []

V Székely, M Rencz, A Poppe, B Courtois
New hardware tools for the thermal transient testing of packages.
In: Tay AAO, Thiam Beng Lim (szerk.)Proceedings of the 3rd Electronics Packaging Technology Conference (EPTC'00). Singapore, Szingapúr, 1998.12.08-1998.12.10. pp. 46-52. ISBN: 0-7803-6644-1 WoS link Dokumentum a kiadónál10.1109/EPTC.2000.906348Adatbázis-linkek: Google scholar link []

Informal Proc. 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology.
Budapest, Magyarország, 1998.05.06-1998.05.08.1998. []

V Székely, M Rencz, S Török, B Courtois
Iddq Testing of Submicron CMOS by Cooling.
In: Proceedings of the Seventh Asian Test Symposium (ATS'98). Singapore, Szingapúr, 1998.12.02-1998.12.04. pp. 1-6. ISBN: 0-8186-8277-9 []

V Székely, M Rencz
Fast Field Solvers for Thermal and Electrostatic Analysis.
In: Proceedings of the conference on Design, Automation and Test in Europe (DATE'98). Paris, Franciaország, 1998.02.23-1998.02.26. pp. 518-523. ISBN: 0-8186-8359-7 WoS link Dokumentum a kiadónál []

Székely Vladimír
THERMODEL: a tool for compact dynamic thermal model generation.
MICROELECTRONICS JOURNAL 29:(4-5) pp. 257-267. (1998)IF, KivonatWoS linkScopus link10.1016/S0026-2692(97)00065-7 []

Szekely Vladimir, Rencz Marta, Courtois Bernard
Thermal Transient Testing of Packages Without a Tester.
In: Tay AAO, Thiam Beng Lim (szerk.)Proceedings of the 3rd Electronics Packaging Technology Conference (EPTC'00). Singapore, Szingapúr, 1998.12.08-1998.12.10. pp. 236-239. ISBN: 0-7803-6644-1 WoS linkScopus link Dokumentum a kiadónál10.1109/EPTC.1998.756008 []

Székely Vladimír
Thermal testing and control by means of built-in temperature sensors.
ELECTRONICS COOLING 4:(3) pp. 36-39. (1998) []

Székely Vladimír
Thermal Monitoring of PC Boards with In-chip, Thermal Test Circuitry.
In: Leo G Henry (szerk.)ESD Testing of Integrated Circuits. Technology Publisher Ltd, 1998. p. 3. (Future Circuits International; 3.)  []

Székely Vladimír
Identification of RC Networks by Deconvolution: Chances and Limits.
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONS 45:(3) pp. 244-258. (1998)IF, KivonatWoS linkScopus link10.1109/81.662698Adatbázis-linkek: DOI link []

Szekely V, Rencz M, Courtois B
Tracing the Thermal Behavior of ICs.
IEEE DESIGN & TEST OF COMPUTERS 15:(2) pp. 14-21. (1998)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/54.679204 []

Szekely V, Rencz M, Karam JM, Lubaszewski M, Courtois B
Thermal Monitoring of Self-checking Systems.
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS 12:(1-2) pp. 81-92. (1998)IF, WoS linkScopus link Dokumentum a kiadónál10.1023/A:1008233907036 []

Szekely V, Rencz M, Courtois B
Thermal investigations of ICs and microstructures II.
MICROELECTRONICS JOURNAL 29:(4-5) pp. 159-162. (1998)WoS linkTeljes dokumentum10.1016/S0026-2692(97)00053-0 []

Szekely V, Rencz M, Torok S, Marta C, Liptak-Fego L
CMOS Temperature Sensors and Built-in Test Circuitry for Thermal Testing of ICs.
SENSORS AND ACTUATORS A-PHYSICAL 71:(1-2) pp. 10-18. (1998)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0924-4247(98)00165-4 []

Székely V, Rencz M, Török S, Végh G, Benedek Zs, Márta Cs, Mizsei J
Advances in the thermal measurement and evaluation techniques.
In: Proceedings of the 4th International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'98). Cannes, Franciaország, 1998.09.27-1998.09.29. IEEE, pp. 5-10. Adatbázis-linkek: Scopus linkWoS link []

Szekely V, Marta Cs, Rencz M, Vegh G, Benedek Zs, Torok S
A thermal benchmark chip: design and applications.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 21:(3) pp. 399-405. (1998)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/95.725202 []

Páhi András, Székely Vladimír
Efficient thermal simulators: SUNRED and Quick THERM.
In: Anon (szerk.)Proceedings of the 1st International Workshop on Design, Test and Applications. Dubrovnik, Horvátország, 1998.06.08-1998.06.10. Zagreb: Faculty of Electrical Engineering and Computing, University of Zagreb, pp. 85-88. ISBN: 953-184009-1 []

Kohari Zs, Szekely V, Rencz M, Pahl A, Dudek V, Hofflinger B
Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED).
MICROELECTRONICS AND RELIABILITY 38:(12) pp. 1881-1891. (1998)IF, WoS linkScopus linkTeljes dokumentum10.1016/S0026-2714(98)00199-1 []

J M Karam, B Courtois, H Boutamine, A Cao, J Rodriguez, V Székely, M Rencz, K Hoffmann, M Glesner
A Composite Integrated Mixed-Technology Design Environment to Support Micro Electro Mechanical Systems Development.
In: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems (MSM'98). Santa Clara, Amerikai Egyesült Államok, 1998.04.06-1998.04.08. Paper T418. ISBN: 0-96661-35-0-3 []

G Hajas, A Páhi, Sz Hajder, A Poppe, M Rencz, V Székely
Thermal investigation of large digital integrated circuits.
In: Proceedings of the 5th International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES'98). Lodz, Lengyelország, 1998.06.18-1998.06.20. pp. 223-227. ISBN: 83-87202-21-5 Teljes dokumentum []

G Hajas, A Páhi, Sz Hajder, A Poppe, M Rencz, V Székely
Thermal Investigation of Digital Integrated Circuits.
In: Proceedings of the 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology. Budapest, Magyarország, 1998.05.06-1998.05.08. pp. 49-54. []

G Hajas, A Páhi, Sz Hajder, A Poppe, M Rencz, V Székely
Logi-thermal simulation: a new approach for considering thermal effects in digital designs.
In: Proceedings of the 1st IEEE International Workshop on Design, Test and Application (WDTA'98). Dubrovnik, Horvátország, 1998.06.08-1998.06.10. pp. 89-92. ISBN: 953-184-009-1 []

Csendes A, Szekely V, Rencz M
An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the ÎźS-THERMANAL.
MICROELECTRONICS JOURNAL 29:(4-5) pp. 241-255. (1998)IF, WoS linkScopus link Dokumentum a kiadónál10.1016/S0026-2692(97)00064-5 []

Courtois B, Szekely V, Rencz M
Thermal Investigations of ICs and Microstructures.
SENSORS AND ACTUATORS A-PHYSICAL 71:(1-2) pp. 1-2. (1998)WoS linkTeljes dokumentum10.1016/S0924-4247(98)00163-0 []

Special double issue containing selected papers from the 3rd International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC Workshop) held in Cannes, France, 21-23 September 1997.
Amsterdam: Elsevier, 1998. 157 p. []

Courtois B, Karam JM, Lubaszewski M, Szekely V, Rencz M, Hofmann K, Glesner M
CAD Tools and Foundries to Boost Microsystems Development.
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY 51:(1-3) pp. 242-253. (1998)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1016/S0921-5107(97)00269-9 []

B Courtois, J M Karam, M Lubaszewski, V Székely, M Rencz, K Hofmann, M Glesner
Cad, Test and Manufacturing of Microsystems.
JOURNAL OF ELECTRICAL ENGINEERING &: p. &. (1998) []

B Courtois, J M Karam, S Mir, M Lubaszewski, V Székely, M Rencz, G Kelly, J Alderman, A Morrissey, K Hofmann, M Glesner
CAD, CAT and MPW for MEMS.
In: Proceedings of the Workshop on Synthesis And System Integration of MIxed Technologies (SASIMI'98). Sendai, Japán, 1998.10.19-1998.10.20. pp. 207-219. []

A. Páhi, V. Székely, M. Rosenthal, M. Rencz
3D Extension of the SUNRED Field Solver.
In: Proceedings of the 4th International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'98). Cannes, Franciaország, 1998.09.27-1998.09.29. pp. 185-190. WoS linkScopus link []

A Páhi, V Székely, M Rencz, A Poppe, Sz Hajder
New software tools for the thermal and electrostatic simulation of microsystem elements.
In: Proceedings of the 5th NEXUSPAN Workshop on Thermal Aspects in Microsystem Technology. Budapest, Magyarország, 1998.05.06-1998.05.08. pp. 162-169. []

Zs. Kohári, V. Székely, M. Rencz, V. Dudek, B. Höfflinger
Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED).
In: Proceedings of The 27th European Solid-State Device Research Conference (ESSDERC'97). Stuttgart, Németország, 1997.09.22-1997.09.24. pp. 496-499. Teljes dokumentumTeljes kötetTeljes kötetTeljes kötet []

V. Székely, M. Rencz
Thermal Test and Monitoring.
In: Proceedings of the European Design and Test Conference (ED&TC'97). Paris, Franciaország, 1997.03.06-1997.03.09. p. 601. ISBN: 0-8186-7039-8 Dokumentum a kiadónál10.1109/EDTC.1995.470328 []

V Székely, M Rencz, A Poppe, A Páhi, G Hajas, L Lipták-Fegó
Uncovering thermally induced behavior of integrated circuits with the SISSI simulation package.
In: Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97). Cannes, Franciaország, 1997.09.21-1997.09.23. pp. 149-152. []

V Székely, M Rencz, B Courtois
Thermal testing of MCMs using Boundary-Scan access.
In: Proceedings of IEEE/IMAPS Advanced Technology Workshop on MCM Test IV. Napa Valley, Amerikai Egyesült Államok, 1997.09.14-1997.09.17. p. &. []

V Székely, Cs Márta, M Rencz, G Végh, Zs Benedek, S Török
Thermal benchmark circuit.
In: Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97). Cannes, Franciaország, 1997.09.21-1997.09.23. pp. 52-54. []

V Székely, A Páhi, A Poppe, M Rencz, A Csendes
SISSSI - a tool for dynamic electro-thermal simulation of analog VLSI cells.
In: Proceedings of the European Design and Test Conference (ED&TC'97). Paris, Franciaország, 1997.03.06-1997.03.09. p. 617. ISBN: 0-8186-7039-8 Dokumentum a kiadónál10.1109/EDTC.1997.582430Adatbázis-linkek: Google scholar link []

V Székely, A Páhi, A Poppe, G Hajas, M Rencz, A Csendes
SISSI: an Electro-Thermal Simulation Tool for IC Design.
In: Proceedings of the 4th International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES'97). Poznan, Lengyelország, 1997.06.12-1997.06.14. pp. 283-293. ISBN: 83-87202-40-1 Kivonat []

V Székely, A Páhi, A Poppe, M Rencz
Electro-Thermal Simulation with the SISSSI Package.
In: Proceedings of the 1st Electronic Circuits and Systems Conference (ECS'97). Bratislava, Szlovákia, 1997.09.04-1997.09.05. pp. 141-146. []

V Székely, A Poppe, M Rencz, A Páhi, G Hajas
Electro-thermal and logi-thermal simulation of ICs.
In: Proceedings of the 9th Hungarian-Korean Seminar on Integrated Circuits and Devices. Budapest, Magyarország, 1997.06.24-1997.06.26. pp. 157-166. []

V Székely, M Rencz, S Török, Cs Márta, G Farkas, Zs Benedek
Design for thermal testability, thermal monitoring of ICs.
In: E Czoboly (szerk.)Proceedings of the Ninth Hungarian-Korean Seminar on Integrated Circuits and Devices. Budapest, Magyarország, 1997.06.24-1997.06.26. pp. 71-80. ISBN: 963-0489880 []

Székely Vladimír
SUNRED: a new thermal simulator and typical applications.
In: Courtois B, Rencz M, Székely VSpecial double issue containing selected papers from the 3rd International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC Workshop) held in Cannes, France, 21-23 September 1997. város? ország? Amsterdam: Elsevier, pp. 84-90. []

Szekely Vladimir, Rencz Marta
Fast Field Solver Programs for Thermal and Electrostatic Analysis of Microsystem Elements.
In: Digest of Technical Papers of the 1997 IEEE/ACM International Conference on Computer-aided Design. San Jose, Amerikai Egyesült Államok, 1997.11.09-1997.11.13. pp. 684-689. ISBN: 0-8186-8200-0 WoS linkScopus link Dokumentum a kiadónál10.1109/ICCAD.1997.643612 []

Székely Vladimír
Convolution calculus in the network theory and identification.
In: Proceedings of the Euroean Conference of Circuit Theory and Design, ECCTD'97. Budapest, Magyarország, 1997.09. pp. 49-56. []

Székely Vladimír, Márta Csaba, Rencz Márta, Végh Gerzson, Benedek Zsolt, Török Sándor
A Thermal benchmark circuit.
In: Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97). Cannes, Franciaország, 1997.09.21-1997.09.23. pp. 52-54. []

Székely Vladimír
A New Evaluation Method of Thermal Transient Measurement Results.
MICROELECTRONICS JOURNAL 28:(3) pp. 277-292. (1997)IF, KivonatWoS linkScopus link10.1016/S0026-2692(96)00031-6Adatbázis-linkek: DOI link []

Szekely V, Rencz M, Courtois B
Thermal Transient Testing.
MICROELECTRONICS INTERNATIONAL 14:(2) pp. 8-10. (1997)Teljes dokumentum10.1108/13565369710800529 []

Szekely V, Rencz M, Courtois B
Thermal Testing Methods to Increase System Reliability.
In: Annual Ieee Semiconductor Thermal Measurement and Management Symposium SEMI-THERM'97. Austin, Amerikai Egyesült Államok, 1997.01.28-1997.01.30. IEEE, pp. 210-217. ISBN: 0-7803-3793-X WoS linkScopus link Dokumentum a kiadónál10.1109/STHERM.1997.566798 []

Szekely V, Rencz M, Courtois B
Thermal Investigations of ICs and Microstructures.
MICROELECTRONICS JOURNAL 28:(3) pp. 205-207. (1997)WoS link Dokumentum a kiadónál10.1016/S0026-2692(96)00024-9 []

Szekely V, Rencz M, Courtois B
Integrating on-chip temperature sensors into DfT schemes and BIST architectures.
In: Proceedings of the 15th IEEE VLSI Test Symposium. Monterey, Amerikai Egyesült Államok, 1997.04.27-1997.05.01. pp. 440-445. ISBN: 0-8186-7810-0 WoS linkScopus link Dokumentum a kiadónál10.1109/VTEST.1997.600330 []

Székely V, Poppe A, Rencz M, Csendes A, Páhi A
Electro-thermal simulation: a realization by simultaneous iteration.
MICROELECTRONICS JOURNAL 28:(3) pp. 247-262. (1997)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1016/S0026-2692(96)00029-8Adatbázis-linkek: Google scholar link []

Székely V, Poppe A, Páhi A, Csendes A, Hajas G, Rencz M
Electro-thermal and logi-thermal simulation of VLSI designs.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 5:(3) pp. 258-269. (1997)IF, WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/92.609868Adatbázis-linkek: Google scholar link []

Szekely V, Rencz M, Torok S, Courtois B
Cooling as a Possible way to Extend the Usability of IDDQ Testing.
ELECTRONICS LETTERS 33:(25) pp. 2117-2118. (1997)IF, WoS linkScopus link Dokumentum a kiadónál []

Szekely V, Marta C, Kohari Z, Rencz M
CMOS sensors for on-line thermal monitoring of VLSI circuits.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 5:(3) pp. 270-276. (1997)IF, WoS linkScopus link Dokumentum a kiadónál10.1109/92.609869Adatbázis-linkek: DOI link []

Szekely V, Rencz M, Courtois B
CAD Tools for Thermal Testing of Electronic Systems.
In: Suhir E, Shiratori M, Lee YC (szerk.)Proceedings of the InterPACK'97. Kohala Coast, Amerikai Egyesült Államok, 1997.05.15-1997.05.17. pp. 2209-2215. Scopus link []

Székely, M Rencz, S Török, G Farkas, Cs Márta
Advances in the thermal testing.
In: Proceedings of the 3rd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'97). Cannes, Franciaország, 1997.09.21-1997.09.23. pp. 5-10. []

Székely, M Rencz, B Courtois
A step forward in the transient thermal characterization of packages.
In: Proceedings of the 30th International Symposium on Microelectronics: Proceedings of SPIE Vol. 3235. Philadelphia, Amerikai Egyesült Államok, 1997.10.14-1997.10.16. pp. 296-301. WoS link []

Ripka G, Székely V, Oroszlány L, Márta Cs
Development of a Heating Foil for Externel Mirrors of Vehicles. 2nd Research and Development Report for TEMIC Hungary GmbH.
Megrendelő: TEMIC Hungary GmbH, 39 p. (1997) []

Kohari Zs, Csendes A, Szekely V, Rencz M
Thermal investigation of monolithic structures.
MICROELECTRONICS JOURNAL 28:(3) pp. 317-325. (1997)IF, WoS linkScopus link Dokumentum a kiadónál10.1016/S0026-2692(96)00035-3 []

J M Karam, B Courtois, H Boutamine, P Drake, A Poppe, V Székely, M Rencz, K Hofmann, M Glesner
CAD and Foundries for Microsystems.
In: Proceedings of the 34th Conference on Design Automation (DAC'97). Anaheim, Amerikai Egyesült Államok, 1997.06.09-1997.06.13. pp. 674-679. WoS linkScopus linkTeljes dokumentum Dokumentum a kiadónál10.1109/DAC.1997.597230Adatbázis-linkek: Google scholar link []

H Boutamine, J M Karam, B Courtois, P Drake, J Orndinot, H El Tahawi, A D Cao, M Rencz, A Poppe, V Székely
Engineering tool set for monolithic and hybrid microsystem design.
In: Craig Fridrich, Akira Umeda (szerk.)Proceedings of SPIE's 1997 Symposium and Education Program on Micromachining and Microfabrication: Vol. 3225 (Microlithography and Metrology in Micromachining III). Austin, Amerikai Egyesült Államok, 1997.09.29-1997.10.02. pp. 236-245. WoS link Dokumentum a kiadónál10.1117/12.284556 Adatbázis-linkek: Google scholar link []

Cs Márta, V Székely, M Rencz, B Courtois
Self-Checking Current Output Temperature Sensor for DfTT.
In: Proceedings of the 3rd IEEE International On-Line Testing Workshop (IOLTW'97). Creta, Görögország, 1997.07.07-1997.07.09. pp. 75-78. []

B Courtois, V Székely, M Rencz, A Napieralski, V Koval, F Beleznay
Main goals and obtained results of the THERMINIC Project.
In: Proceedings of the EUROTHERM Seminar N 58. Nantes, Franciaország, 1997.09.24-1997.09.26. pp. 122-128. []

B Courtois, J M Karam, M Lubaszewski, V Székely, M Rencz, K Hofmann, M Glesner
CAD, Test and Manufacturing of Microsystems.
In: Proceedings of the 1st Electronic Circuits and Systems Conference (ECS'97). Bratislava, Szlovákia, 1997.09.04-1997.09.05. pp. 109-117. []

B Courtois, J M Karam, M Lubaszewski, V Székely, M Rencz, A Poppe, K Hofmann, M Glesner
CAD Tools and Foundries to Boost Microsystems Development.
In: Proceedings of The Second International Conference on Low Dimensional Structures & Devices (LDSD'97). Lisbon, Portugália, 1997.05.19-1997.05.21. pp. 242-253. []

Ripka G, Székely V, Oroszlány L
Development of a Heating Foil for Externel Mirrors of Vehicles. Research and Development Report for TEMIC Hungary GmbH.
Megrendelő: TEMIC Hungary GmbH, 37 p. (1997) []

V. Székely, A. Csendes, M. Rencz
ÎźS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCMs.
In: Michael T Postek Jr, Craig R Friedrich (szerk.)Proceedings of SPIE Vol. 2880: Microlithography and Metrology in Micromachining II. Austin, Amerikai Egyesült Államok, 1996.10.14-1996.10.15. (2880) SPIE, pp. 64-75. WoS linkScopus link Dokumentum a kiadónál10.1117/12.250968 []

V. Székely, M. Rencz, B. Courtois
Trends in Thermal Management of Microcircuits.
In: S Luryi, J Xu, A Zaslavsky (szerk.)Proceedings of the NATO Advanced Research Workshop. Ile de Bendor, Franciaország, 1995.07.17-1995.07.21. pp. 311-316. Paper App. D-6. (NATO Science Series E: Applied Sciences; Vol. 323.)ISBN: 978-0-7923-4169-7 []

V. Székely, M. Rencz, B. Courtois
Thermal transient testing of the quality of encapsulation.
In: Proceedings of IEEE/ISHM Advanced Technology Workshop on MCM Test III. Napa Valley, Amerikai Egyesült Államok, 1996.09.15-1996.09.18. pp. 25-31. []

V. Székely, M. Rencz, B. Courtois
Thermal Transient Testing.
In: Proceedings of the 29th International Symposium on Microelectronics: Proceedings of SPIE, Vol. 2920. Minneapolis, Amerikai Egyesült Államok, 1996.10.08-1996.10.10. pp. 18-23. ISBN: 0-930815-48-3 WoS link []

V. Székely, M. Rencz, J. M. Karam, M. Lubaszewski, B. Courtois
Thermal monitoring of self-checking systems.
In: Proceedings of the 2nd IEEE International On-Line Testing Workshop (IOLTW'96). Biarritz, Franciaország, 1996.07.08-1996.07.10. pp. 6-12. []

V. Székely, M. Rencz, B. Courtois
Thermal monitoring of memories.
In: Proceedings of the 1996 IEEE International Workshop on Memory Technology, Design and Testing. Singapore, Szingapúr, 1996.08.13-1996.08.14. pp. 86-91. ISBN: 0-8186-7466-0 Dokumentum a kiadónálTeljes kötetTeljes kötetTeljes kötet []

V Székely, M Rencz, J M Karam, M Lubaszewski, B Courtois
Thermal monitoring of safety-critical integrated systems.
In: Proceedings of the Fifth Asian Test Symposium (ATS'96). Hsinchu, Tajvan, 1996.11.20-1996.11.22. pp. 282-288. WoS linkScopus link10.1109/ATS.1996.555172 []

V Székely, M Rencz
Thermal Investigation of Microsystems.
In: Jones W K, Harsányi G (szerk.)Multichip Modules with Integrated Sensors: Proceedings of the NATO Advanced Research Workshop. Kluwer Academic Publishers, 1996. pp. 1-10. (NATO ASI Series 3; 16.) 0792341945Amazon keresőGoogle keresőCopac ISBN: 0792341945 Adatbázis-linkek a kötethez: Amazon linkGoogle books link []

V Székely, Cs Márta, Zs Kohári, M Rencz
New temperature sensors for DfTT applications.
In: Proceedings of the 2nd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'96). Budapest, Magyarország, 1996.09.25-1996.09.27. pp. 49-55. []

V Székely, A Páhi, A Poppe, M Rencz
Electro-Thermal Simulation of ICs Based on the Electrical and Thermal Netlist Extracted from the Layout.
In: Proceedings of the 3rd International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES'96). Lodz, Lengyelország, 1996.05.30-1996.06.01. pp. 250-255. ISBN: 83-906066-0-7 Kivonat []

V Székely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
Electro-thermal and logi-thermal simulation of VLSI designs.
In: Proceedings of the 2nd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'96). Budapest, Magyarország, 1996.09.25-1996.09.27. pp. 79-88. Teljes dokumentum []

V Székely, A Poppe, M Rencz, G Farkas, A Csendes, A Páhi
An efficient method for the self-consistent electro-thermal simulation and its integration into a CAD framework.
In: Proceedings of the European Design and Test Conference (ED&TC'96). Paris, Franciaország, 1996.03.11-1996.03.14. p. 604. WoS link Dokumentum a kiadónál10.1109/EDTC.1996.494368 Adatbázis-linkek: Google scholar link []

Székely Vladimír
THERMODEL: a tool for compact dynamic thermal model generation.
SENSORS AND ACTUATORS 1996: pp. 21-26. (1996) []

Székely Vladimír
Thermal investigations of microsystems.
In: Proceedings of the 5th Biennial Baltic Electronics Conference (BEC'96). Tallinn, Észtország, 1996.10.07-1996.10.11. pp. 29-36. []

Székely Vladimír
Thermal investigations of microsystems.
In: Anon (szerk.)BEC '96, the 5th Biennial Baltic Electronics Conference. Tallinn, Észtország, 1996.10.07-1996.10.11. Tallinn: Tallinn Technical University, pp. 29-36. ISBN: 9985590260 []

Székely Vladimír, Kowalczyk A
The Role of Thermal Transient Measurements in MST.
In: Anon (szerk.)II International NEXUSEAST/NEXUSPAN Workshop on Microsystem Technology. Szczyrk, Lengyelország, 1996.05.16-1996.05.18. Warsaw: NCP, pp. 56-61. []

Székely Vladimír
CMOS Compatible Temperature Sensors.
JOURNAL OF COMMUNICATION 47: pp. 13-17. (1996) []

Székely Vladimir, Poppe András
Áramkörszimuláció a PC-n.
Budapest: ComputerBooks Kiadó, 1996. 310 p.(ISBN:963 618 080 6)Copac []

Szekely V, Kohari Zs, Marta Cs, Rencz M, Courtois B
Test Structure for Thermal Monitoring.
In: Proceedings of the 1996 IEEE International Conference on Microelectronic Test Structures (ICMTS'96). Trento, Olaszország, 1996.03.25-1996.03.28. IEEE, pp. 111-115. ISBN: 0-7803-2783-7 KivonatWoS linkScopus link10.1109/ICMTS.1996.535630 []

Szekely V, Rencz M, Courtois B
Editorial: Special issue containing selected papers from the International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC Workshop) held in Grenoble, France, 25-26 September 1995.
SENSORS AND ACTUATORS A-PHYSICAL 55:(1) pp. 1-2. (1996)KivonatWoS link10.1016/S0924-4247(97)80058-1 []

Székely V, Marta Cs, Rencz M, Benedek Zs, Courtois B
Design for thermal testability (DfTT) and a CMOS realization.
SENSORS AND ACTUATORS A-PHYSICAL 55:(1) pp. 29-33. (1996)IF, WoS linkScopus link Dokumentum a kiadónál10.1016/S0924-4247(96)01246-0 []

J M Karam, B Courtois, K Hofmann, A Poppe, M Rencz, M Glesner, V Székely
Microsystems Modeling at System Level.
In: Proceedings of the 3rd Asia Pacific Conference on Hardware Description Languages (APCHDL'96). Bangalore, India, 1996.01.08-1996.01.10. pp. 34-39. []

J M Karam, B Courtois, M Rencz, A Poppe, V Székely
Microsystem Design Framework based on Tool Adaptations and Library Developments.
In: Proceedings of SPIE'96 Symposium on Micromachining and Microfabrication. Austin, Amerikai Egyesült Államok, 1996.10.14-1996.10.15. (2880)pp. 236-245. (2880.)WoS linkScopus link Dokumentum a kiadónálAdatbázis-linkek: Google scholar link []

J M Karam, B Courtois, K Hofmann, A Poppe, M Rencz, M Glesner, V Székely
CAD of MEMS: from the idea to the reality.
In: Proceedings of the 3rd France-Japan Congress and 1st Europe-Asia Congress on Mechatronics. Besancon, Franciaország, 1996.10.01-1996.10.03. (1)pp. 70-75. Teljes dokumentum []

J M Karam, B Courtois, K Hofmann, M Glesner, A Poppe, M Rencz, V Székely
Applied design and analysis of microsystems.
In: Proceedings of the European Design and Test Conference (ED&TC'96). Paris, Franciaország, 1996.03.11-1996.03.14. pp. 528-532. WoS linkScopus link Dokumentum a kiadónál10.1109/EDTC.1996.494351 []

Csendes A, Szekely V, Rencz M
Thermal mapping with liquid crystal method.
MICROELECTRONIC ENGINEERING 31:(1-4) pp. 281-290. (1996)IF, WoS linkScopus link Dokumentum a kiadónál10.1016/0167-9317(95)00350-9 []

A Csendes, V Székely, M Rencz
ÎźS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCMs.
In: Proceedings of the 2nd International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'96). Budapest, Magyarország, 1996.09.25-1996.09.27. pp. 13-20. []

V. Székely, M. Rencz
Thermal Investigations of Microsystems.
In: Nato Advanced Research Workshop & Exhibition on MCM & Sensor Technologies. Budapest, Magyarország, 1995.05.18-1995.05.20. p. &. []

V. Székely, M. Rencz
A New Monolithic Temperature Sensor: the Thermal Feedback Oscillator.
In: Proceedings of Eurosensors IX and The 8th International Conference on Solid-State Sensors and Actuators (Transducers'95). Stockholm, Svédország, 1995.06.25-1995.06.29. (2)pp. 124-127. ISBN: 91-630-3473-5 Scopus link Dokumentum a kiadónál []

V Szekely, M Rencz
Thermal Monitoring of Microstructures.
In: Proccedings of the 2nd Advanced Training Course Mixed Design of VLSI Circuits (MIXVLSI'95). Krakow, Lengyelország, 1995.05.29-1995.05.31. pp. 140-145. []

V Székely, A Poppe, M Rencz, A Csendes, A Páhi
Self-Consistent Electro-Thermal Simulation: Fundamentals and Practice.
In: Collection of Papers presented at the 1st International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'95). Grenoble, Franciaország, 1995.09.25-1995.09.26. pp. 188-194. []

V Szekely, M Rencz
On-line Thermal Testing of Microstructures.
In: Proceedings of the 4th Annual Atlantic Test Workshop (ATW'95). Durham, Amerikai Egyesült Államok, 1995.05.31-1995.06.01. pp. 1-9. []

V Székely, M Rencz
Novel temperature sensor for on-line thermal testing.
In: Proceedings of the 6th International Symposium on IC technology, Systems and Applications (ISIC'95). Singapore, Szingapúr, 1995.09.06-1995.09.08. pp. 497-500. WoS link []

V Szekely, Zs Benedek, Zs Kohari, Cs Marta, M Rencz
Novel method for On-line Thermal Monitoring of Electronic Systems.
In: Proceedings of the 1st IEEE International On-Line Testing Workshop. Nice, Franciaország, 1995.07.04-1995.07.05. IEEE, pp. 136-138. []

V Székely, Cs Márta, M Rencz, Zs Benedek, B Courtois
Design for Thermal Testability (DfTT) and a CMOS Realization.
In: Collection of Papers presented at the 1st International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'95). Grenoble, Franciaország, 1995.09.25-1995.09.26. pp. 10-14. []

V Székely, Cs Márta, M Rencz, B Courtois
A New Approach: Design for Thermal Testability (DfTT) of MCMs.
In: Proceedings of Advanced Technology Workshop on MCM Test II. Napa Valley, Amerikai Egyesült Államok, 1995.09.10-1995.09.13. pp. 1-3. []

Székely Vladimír, Rencz Márta
Thermal Test and Monitoring.
In: Anon (szerk.)Proceedings of The European Design and Test Conference: ED&TC '95. Paris, Franciaország, 1995.03.06-1995.03.09. Los Alamitos: IEEE Computer Society Press, p. 601. ISBN: 0818670398 WoS link []

Székely Vladimír
Distributed RC networks.
In: Wai-Kai Chen (szerk.)The Circuits and Filters Handbook. CRC Press LLC, 1995. pp. 1203-1221.  0-8493-8341-2Amazon keresőGoogle keresőCopac ISBN: 0-8493-8341-2 []

Székely Vladimír
A New Evaluation Method of Thermal Transient Measurement Results.
In: Proceedings of the 1st International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'95). Grenoble, Franciaország, 1995.09.25-1995.09.26. pp. 108-114. []

Poppe A, Rencz M, Szekely V, Karam J M, Courtois B, Hofmann K, Glesner M
CAD Framework Concept for the Design of Integrated Microsystems: Micromachined Devices and Components.
In: Ray Roop, Kevin Chau (szerk.)Micromachined Devices and Components. Austin, Amerikai Egyesült Államok, 1995.10.23-1995.10.25. (2642)pp. 215-224. Paper 25. (Proceedings of SPIE - The International Society for Optical Engineering; 2642.)WoS linkScopus link Dokumentum a kiadónál10.1117/12.221171 []

A. Csendes, V Székely, M Rencz
Resolution, accuracy and other features of liquid crystal thermal mapping.
In: Collection of Papers presented at the 1st International Workshop on THERMal INvestigations of ICs and Microstructures (THERMINIC'95). Grenoble, Franciaország, 1995.09.25-1995.09.26. pp. 164-168. []

A Poppe, J M Karam, K Hofmann, M Rencz, B Courtois, M Glesner, V Székely
A general CAD concept and design framework architecture for integrated microsystems.
In: Adey RA, Lahrmann A, Lessmölmann C (szerk.)Proceedings of the 1st International Conference on Simulation and Design of Microsystems and Microstructures (MICROSIM'95). Southampton, Egyesült Királyság, 1995.09.26-1995.09.28. Southampton ; Boston: Computational Mechanics Publications, pp. 259-266. KivonatWoS link []

A Csendes, V Szekely, M Rencz
Thermal Mapping with Liquid Crystal Method.
In: Proceedings of the 5th European Conference on Electron and Optical Beam Testing of Electronic Devices (EOBT'95). Wuppertal, Németország, 1995.08.27-1995.08.30. []

Székely Vladimír
Thermal Monitoring of Microelectronic Structures.
MICROELECTRONICS JOURNAL 25:(3) pp. 157-170. (1994)KivonatWoS linkScopus link10.1016/0026-2692(94)90008-6 []

Székely Vladimír
Képkorrekció, hanganalízis, térszámítás PC-n: gyors Fourier transzformációs módszerek.
Budapest: ComputerBooks Kiadó, 1994. 236 p.(ISBN:963-618-136-5)Copac []

Székely Vladimír
Comments on "Selfheating effects in silicon resistors operated at cryogenic ambient temperatures.
SOLID STATE ELECTRONICS 37:(3) pp. 515-516. (1994)IF, WoS linkScopus link10.1016/0038-1101(94)90019-1 []

V Székely, M Kerecsen-Rencz
The results of the 3 year TEMPUS activity at the DED-TUB.
In: Proceedings of the TEMPUS Workshop on Computer Aided Methods and Technical Management in Electrical Engineering Education. Budapest, Magyarország, 1993.06.16-1993.06.18. p. &. []

Székely Vladimír
Thermal monitoring of microelectronic structures.
In: András Poppe (szerk.)Proceedings of the Fourth Mideuropean conference on custom/application specific integrated circuits. Budapest, Magyarország, 1993.05.19-1993.05.20. Budapest: MATE, pp. 91-100. Kötet megjegyzések: org. by The Scientific Society of Measurement and Automation, Technical University of Budapest, Department of Electron Devices, Kálmán Kandó College of Electronic Engineering []