![Integrated microscale heat sinks](https://www.eet.bme.hu/wp-content/uploads/2015/02/fig6-705x320.jpg)
Integrated microscale heat sinks
By creating novel chip-level cooling solutions, our team introduces heat-transfer capabilities beyond imagination.
![Intergrated thermal solutions](https://www.eet.bme.hu/wp-content/uploads/2015/02/ITM-scheme_2-705x289.png)
Intergrated thermal solutions
Experts in field of CFD simulations, thermal measurement, we are offering novel solutions for the industry.
![Injection locked oscillators](https://www.eet.bme.hu/wp-content/uploads/2015/02/icdesign-705x294.jpg)
Injection locked oscillators
Together with our master students oscillators with a wide locking range has been created that had never seen in the industry.
![Integrated circuit packaging](https://www.eet.bme.hu/wp-content/uploads/2015/02/szakirany-705x294.jpg)
Integrated circuit packaging
Beside the packaging itself, our Department is dealing with thermal and signal integrity analysis of IC packages, which is the enabling technology of 3D IC, stack-die structures.
![Solid state lighting](https://www.eet.bme.hu/wp-content/uploads/2018/01/Marcitermlab-705x247.png)
Solid state lighting
Solid-state light sources are new paradigms in the field of lighting technologies. Beside their energy efficiency, their applicability is far beyond our expectations.
![Thermal analysis](https://www.eet.bme.hu/wp-content/uploads/2018/01/t3sterállom.png)
Thermal analysis
Our Department is an internationally recognized research center in the field of thermal analysis of electronic components.
![Cleanroom technologies](https://www.eet.bme.hu/wp-content/uploads/2018/01/mirc.png)
Cleanroom technologies
Available only in a few sites in Hungary, our cleanroom is ready to be used by our industry and academic partners.