Brief description of the research infrastructure

BME Department of Electron Devices is the only university department in Hungary, where research and education portfolio includes microelectronics; semiconductor devices; micro and nanoelectronic devices; VLSI electronics; semiconductor sensors; LEDs; solar cells; MEMS and SiP/SoP smart system design, manufacturing and testing. We have significant results in the field of information technology as well. These are related to computer aided design of micro and nanoelectronics and Internet-based communication. The infrastructural background is provided by our laboratory complexes rebuilt between 2010 and 2012 in the Q building of the University, namely the Thermal Testing Laboratory, the Integrated Smart System Design Laboratories and the Semiconductor and Reliability Laboratories.

Semiconductor and Reliability Testing Laboratories


Class 1000 (ISO 6) and Class 10000 (ISO 7) cleanroom laboratory with 2-3 inch silicon wafer processing for realization of diodes, MOS circuits, sensors, novel devices, microfluidics and solar cell structures. Available processes: fotolithography (1 um resolution, two-sided alignment), wet chemistry (cleaning, isotropic and anisotropic etching), surface treatment (O2, N2, Ar plasma), high-temperature processes (oxidation, dopant diffusion, annealing), evaporation (Al, Au, Ag, Ni, Ti, Cu), RF sputtering (Pt, Pd, Ti, V, Ta, Al, Cu, Ag, Mo, Fe, Ni, SnO2, ZnO, Si, SiC, Sn-In, SiO2, Si3N4, Al2O3), spin-coating (SiO2, PDMS, SU-8), screen-printing (Al, Ag). The laboratory also has capabilities for the investigation of the processed samples or devices: optical microscopy, SEM, mechanical profilometry, Spreading resistance probe, SPV and Kelvin probe surface potential mapping, CV curve acquisition, as well as specific, project related individual measurements, e.g. self developed solar cell testing equipment (I-V and SR).

Dr. Balázs Plesz

Bonding in the Semiconductor Laboratory

Rapid Prototyping Laboratory

Prototyping and production of microfluidic devices on PDMS and SU-8 based technology (10 um resolution). Fabrication of PDMS-glass, PDMS-silicon, PDMS-SU-8 heterostructures and PDMS membranes. Development and prototyping of in-channel integrated sensors: electrodes produced by vacuum evaporation and RF sputtering, temperature and photo sensors. Surface treatment of microchannels in Oxygen and Nitrogen plasma. Fabrication of integrated valves in PDMS chips. Integrated, programmable test environment based on Micronit Fluidic Connect Pro standard. Generation of controlled flows (100 nl/sec resolution) with optical (120 fps) and pressure sensors (10 Pa resolution) feedback. One phase, and two phase (oil-water and gas-water droplet flows) and multiphase (magnetic nanobead) flow in thermally steady environment. Standard equipments for biofluid handling (centrifuge, vortex, laminar box, pipettes, US chamber).

Dr. Ferenc Ender

Rapid prototyping of a microfluidic system

Thermal Testing Laboratory

Numerous international and national projects were based on the know-how and advanced infrastructure of this laboratory. This laboratory is specialized mainly in the thermal and multidomain characterization of various semiconductor devices and their assembly/packaging, like packaged ICs, discrete devices, power electronics, solar cells, LEDs and MEMS, including the non-destructive examination of such structures. Beyond the general instruments this laboratory is equipped with special equipment compliant with the latest international standards (e.g. JEDEC JESD51-14, JEDEC JESD51-51 and 51-52) for thermal transient testing and radiometric/photometric characterization. IR cameras are also available for thermal investigations. This laboratory environment enables the testing of special structures like organic light emitting devices and nanoparticle-based thermal interface materials (TIMs).

Professor András Poppe, Head of Department

Radiometric measurement using the TERALED equipment

Integrated Smart System Design Laboratories

These laboratories have the latest industrial CAD softwares for complex, highly integrated, mixed-signal integrated circuit schematic and layout design, functional pre-layout and post-layout simulation. As a result of our R&D activities the multi-domain modelling of these circuits is also possible: our software tools enable the simultaneous evaluation of electric and thermal behavior with the aid of electro-thermal and logi-thermal simulations. Furthermore, the design, numerical modeling and simulation of sensors and actuators (MEMS), as building blocks for integrated smart systems, are also possible in advanced simulation environments. The design of complex RF PCBs are supported by the latest design tools and post-layout simulation softwares, enabling the evaluation of RF wave propagation properties, like reflection and electrical crosstalk.

The 3 laboratories in the lab complex are namely the Mentor Graphics IC Design Laboratory (25 seats – CAD stations), the Ericsson Complex Hardware Design Lab (25 seats – CAD and FPGA design stations) and the Digital Innovation Laboratory (5 seats each for an individual innovation project).

Dr. András Timár

Mentor Graphics IC Design Laboratory