Biography

Education

• 2007-2010           Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics, Electrical Engineering Ph.D. studies, Electrical Engineering Sciences Doctoral School, Microelectronics and technology group

• 2002-2007           Budapest University of Technology and Economics, Faculty of Electrical Engineering and Informatics, Electrical Engineering, 5-year M.Sc. EE course, Microelectronics and Modulecircuits major module, New type of physical methods in telecommunications minor module

Language skills

• English  C1    ECL, complex, state accredited language examination certificate
• Spanish B1    ORIGO, complex, state accredited language examination certificate
• German A1

Project activity

• Horizon 2020 PowerizeD - Digitalization of Power Electronic Applications within Key Technology Value Chains (2023-2025)
• Horizon 2020 AI-TWILIGHT AI powered Digital twin for lighting infrastructure in the context of front-end Industry 4.0 (2021-2024)
• NKFIH K_20 135224 sz. kutatási témapályázata Thermal issues in chiplet-based System-on-Package devices (2020-2024)
• Horizon 2020 DigiFed Digital Innovation Hubs (DIH) federation for large scale adoption of digital technologies by European SMEs (2020-2023)
• Országos Tudományos Kutatási Alapprogramok 109232 sz. pályázata Integrated thermal management in System-on-Package devices (2014-2018)
• Smart Systems Integration Erasmus Mundus Joint International Master in Smart Systems Integration (2014-2018)
• Eniac JEMSiP_3D Evaluation of SiP solutions to optimize the dissipation using thermal simulations (period 2009-2012)
• NanoPack EU Framework Programme 7 Design of a static TIM tester for the measurement of new type thermal interface materials (period 2007-2010)
• Eniac SE2A Nanoelectronics for safe, fuel efficient and environment friendly automotive solutions (period 2009-2011)
• PATENT DfMM EU 507255   Research and Design for manufacture of micro- and nanoelectronic devices (period 2004-2007)

Education

• Smart systems integration
• Micro-electromechanical systems (MEMS)
• Microelectronics
• Coupled (multi)physics
• RF PCB design
• Fundamentals of computing

Research activity

• Design, simulation, characterization and multiphysical modelling of micro-electromechanical systems (MEMS)
• Characterization and modelling of microscale heatsink structures
• Characterization, modelling and investigation of thermal properties of microelectronic devices, PCBs and equipement.
• Simulation and estimation of measurement error of Static TIM tester
• RF circuitry matching on PCB

Other responsibilities

• BME Coordinator of the BME-Ericsson Hardware Lab cooperation.
• Member of the Faculty Council of the Faculty of Electrical Engineering and Informatics.